Multizone Thermal Interface for Independent Multi-Die Package Cooling
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Solution Overview
Problem
Existing thermal management techniques for semiconductor devices, particularly those with multiple chips or dies, lack the ability to independently control thermal conditions in different regions, leading to inefficient testing and reliability issues.
Innovation Solution
A thermal management system with independently controllable zones interfaces with multi-die packages, allowing for separate control of thermal conditions in each region through a coolant delivery system managed by a control system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing thermal management techniques are used for multi-die packages, then general cooling is provided, but independent thermal control in different regions is not achieved
Solution Approach 1:
The thermal management system is divided into multiple independently controllable zones, with each zone having its own heating or cooling capability. This segmentation allows different regions of the multi-die package to be controlled at different temperatures, resolving the contradiction between achieving independent thermal control and maintaining system simplicity.
Solution Approach 2:
Different zones within the thermal management system are assigned different thermal properties and control parameters based on the specific requirements of the underlying dies. High-power dies receive enhanced cooling while low-power dies receive standard cooling, optimizing thermal management for each local region's needs.
2Productivity
If uniform cooling is applied to all dies, then simple thermal management is maintained, but testing time increases due to inability to optimize cooling for high-power devices
Solution Approach 1:
The coolant delivery system dynamically adjusts flow rates to different zones based on real-time thermal requirements. High-power dies receive higher coolant flow rates during intensive testing, while low-power dies receive reduced flow, optimizing testing efficiency without requiring a permanently complex system architecture.
Solution Approach 2:
The system changes operational parameters (coolant flow rate, temperature) for different zones based on the specific testing requirements and power consumption characteristics of each die, enabling optimized testing efficiency without permanent structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances cooling efficiency, reduces testing time, and improves binning efficiency by allowing targeted cooling of high-power devices, thereby ensuring quality and reliability of multi-die packages.
Implementation Method 1
A coolant is established to the thermal management component
Implementation Method 2
delivering a first thermal condition to a first region of the semiconductor device while delivering a second thermal condition to a second region
Data Source
AI summary
A test method and system of testing a semiconductor device is provided. The method includes placing a packaged semiconductor device on a tester and engaging a thermal management component with an upper surface of the packaged semiconductor device. The packaged semiconductor device is tested using the tester, and during the testing a first thermal condition is delivered to a first region of the thermal management component while delivering a second thermal condition is delivered to a second region of the thermal management component. The first thermal condition is different than the second thermal condition.