Multizone Thermal Control for Multi-Die Semiconductor Testing

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Solution Overview

Problem

Thermal management during the testing of packaged semiconductor structures, particularly those with multiple chips or dies, is challenging due to the lack of independent control over different regions, leading to inefficient cooling and the need for multiple temperature tests.

Innovation Solution

A thermal management system with independently controllable zones interfaces a multi-chip packaged device, allowing separate control of thermal conditions for each region, and direct heat exchange between the device and coolant, eliminating the need for thermal interface material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single thermal management system is used for multi-chip packages, then the device structure is simple, but independent thermal control for each chip is lost

Engineering Contradiction:

Improvethermal management system structureVSAvoidindependent thermal control capability

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The thermal management system is divided into multiple independently controllable zones, with each zone corresponding to a specific chip or die. Each zone has its own coolant delivery system with adjustable flow rate and temperature control, enabling independent thermal management for each chip while maintaining a unified system architecture.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the thermal management system are configured with different coolant flow rates, temperatures, and delivery parameters tailored to the specific thermal requirements of each chip. High-power chips receive higher coolant flow rates and lower temperatures, while low-power chips receive optimized cooling appropriate to their needs.

Inventive Principle:

Principle #3Local quality

2Reliability

If thermal interface material is used between device and coolant, then heat transfer is facilitated, but additional material layers and potential thermal resistance are introduced

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidinterface structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The thermal interface material layer is completely removed from the system. Instead, the invention uses direct liquid coolant impingement onto the chip surfaces through precisely positioned nozzles, eliminating the thermal resistance introduced by interface materials while simplifying the interface structure between the cooling system and the chips.

Inventive Principle:

Principle #2Taking out (Extraction)

3Manufacturing precision

If multiple temperature tests are performed on multi-chip packages, then comprehensive thermal characterization is achieved, but testing time increases

Engineering Contradiction:

Improvethermal characterization accuracyVSAvoidtesting time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The thermal management system dynamically adjusts coolant flow rates, temperatures, and distribution patterns during testing. Multiple temperature conditions and thermal scenarios can be implemented simultaneously across different chips by independently controlling each zone's cooling parameters, allowing comprehensive thermal characterization in a single test run rather than requiring multiple sequential tests.

Inventive Principle:

Principle #15Dynamics

4Ease of operation

If uniform cooling is applied to all chips, then the cooling system is simple to control, but high-power devices cannot be targeted for enhanced cooling

Engineering Contradiction:

Improvecontrol simplicityVSAvoidcooling effectiveness for high-power devices

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

Each chip's cooling zone is configured with specific coolant flow rates, temperatures, and nozzle positioning optimized for that chip's power dissipation characteristics. High-power devices receive intensified cooling with higher flow rates and lower temperatures, while low-power devices receive appropriate cooling levels, with all parameters independently adjustable through the control system.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This system enhances cooling efficiency, reduces testing time, and improves binning efficiency by allowing targeted cooling of high-power devices, enabling simultaneous testing at varying temperatures across different dies.

Implementation Method 1

direct heat exchange between the device and coolant

Methodology Applied

Scientific EffectHeat exchange: Conduction (thermal)

Implementation Method 2

delivering a coolant to a first region of the thermal management component

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250357269A1Multizone thermal device for semiconductor structures

Publication Date: 2025.11.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A test method and system of testing a semiconductor device is provided. The method includes placing a packaged semiconductor device on a tester and engaging a thermal management component with an upper surface of the packaged semiconductor device. The packaged semiconductor device is tested using the tester, and during the testing a first thermal condition is delivered to a first region of the thermal management component while delivering a second thermal condition is delivered to a second region of the thermal management component. The first thermal condition is different than the second thermal condition.