Mutually Inductive Coupled Coils for Uniform Plasma Generation
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Solution Overview
Problem
Plasma generating apparatuses with single induction coil structures face limitations in generating uniform plasma over large-area substrates, leading to non-uniform voltage distribution and reduced process yield in semiconductor and solar cell manufacturing.
Innovation Solution
A plasma generating apparatus with multiple mutually-inductively coupled coils and a reactance element coupled to the ground terminal, along with phase adjusters and shunt reactance elements, ensures uniform plasma generation by maintaining equal voltage levels across all electromagnetic field applying units, thereby addressing the non-uniformity and increasing the yield of large-area substrate treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single induction coil structure is used, then the device complexity is reduced, but the plasma uniformity deteriorates
Solution Approach 1:
The single induction coil is divided into multiple coils (first induction coil and second induction coil) that are mutually inductively coupled. Each coil is controlled independently with separate RF power supplies, allowing independent adjustment of voltage and phase to achieve uniform plasma distribution across the chamber.
Solution Approach 2:
The system dynamically adjusts the RF power supplied to each coil individually. The control unit monitors and regulates the voltage and phase of each coil in real-time, enabling adaptive optimization of plasma uniformity based on actual operating conditions and chamber geometry.
2Manufacturing precision
If multiple mutually-inductively coupled coils are used, then the plasma uniformity is improved, but the device complexity increases
Solution Approach 1:
Multiple induction coils are mutually inductively coupled and operated together as an integrated system. The coils share a common magnetic core and are controlled by a unified control unit that coordinates their operation, merging their individual effects to achieve uniform plasma generation across the entire chamber area.
Solution Approach 2:
The control unit adjusts the RF power to each coil such that the voltage at the input terminal of each coil is maintained at substantially the same level. This equipotential operation ensures that electromagnetic energy is distributed uniformly throughout the chamber, producing consistent plasma density across the substrate area.
3Device complexity
If a single induction coil is used, then the voltage distribution is simpler, but the plasma generation uniformity deteriorates
Solution Approach 1:
The system dynamically adjusts the RF power supplied to each coil individually. The control unit monitors and regulates the voltage and phase of each coil in real-time, enabling adaptive optimization of plasma uniformity based on actual operating conditions and chamber geometry.
Solution Approach 2:
The invention changes the operating parameters (voltage, phase, and RF power level) of each coil independently. By adjusting these parameters, the system compensates for non-uniformities in the chamber and achieves uniform plasma distribution, transforming the voltage distribution profile from non-uniform to uniform across the substrate area.
4Manufacturing precision
If multiple electromagnetic field applying units are used, then the plasma uniformity is improved, but the phase control complexity increases
Solution Approach 1:
The control unit continuously monitors the plasma generation status and adjusts the phase and amplitude of RF power supplied to each coil accordingly. This feedback mechanism automatically compensates for phase differences and ensures that all coils contribute equally to uniform plasma distribution, eliminating the need for manual phase calibration.
Solution Approach 2:
The control unit adjusts the RF power to each coil such that the voltage at the input terminal of each coil is maintained at substantially the same level. This equipotential operation ensures that electromagnetic energy is distributed uniformly throughout the chamber, producing consistent plasma density across the substrate area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform plasma generation across the chamber, enhancing the yield of large-area substrate treatments by ensuring consistent electromagnetic field induction and plasma density, even in large-sized chambers.
Implementation Method 1
a plurality of electromagnetic field applying units inducing an electromagnetic field by receiving the RF signal
Implementation Method 2
each of the electromagnetic field applying units includes a plurality of mutually-inductively coupled coils
Implementation Method 3
generates plasma from a gas supplied to the chamber by using the induced electromagnetic field
Data Source
AI summary
Provided are a plasma generating apparatus using mutual inductive coupling and a substrate treating apparatus including the same. According to an embodiment of the present invention, a plasma generating apparatus includes: an RF power supply providing an RF signal; a plurality of electromagnetic field applying units inducing an electromagnetic field by receiving the RF signal; and a reactance element connected to a ground terminal of the electromagnetic field applying unit, wherein each of the electromagnetic field applying units may include a plurality of mutually-inductively coupled coils.