MXene Films and Composites for Lightweight EMI Shielding

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current electromagnetic interference (EMI) shielding materials, such as metal shrouds, are heavy and costly, and polymer-matrix composites with conductive fillers do not provide high enough EMI shielding effectiveness for modern, compact electronic devices.

Innovation Solution

The use of two-dimensional transition metal carbides, nitrides, and carbonitrides, specifically MXene films and MXene-polymer composites, which are applied as coatings to objects to provide high EMI shielding due to their exceptional electrical conductivity and mechanical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal shrouds are used for EMI shielding, then EMI shielding effectiveness is improved, but weight and cost increase

Engineering Contradiction:
ImproveEMI shielding effectivenessVSAvoidweight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The patent changes the material parameters from traditional metals to two-dimensional transition metal carbides (MXenes), which have comparable or superior electrical conductivity but significantly lower density. This parameter change allows achieving high EMI shielding effectiveness while reducing weight.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures, specifically MXene-polymer composites and multilayer MXene configurations, which combine the high conductivity of MXenes with the mechanical properties of polymers, achieving effective EMI shielding with reduced weight compared to solid metal shrouds.

Inventive Principle:
Principle #40Composite materials

2Reliability

If metal shrouds are used for EMI shielding, then EMI shielding effectiveness is improved, but cost increases

Engineering Contradiction:
ImproveEMI shielding effectivenessVSAvoidcost
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent substitutes expensive metals with MXene materials that offer similar or better electrical conductivity at lower cost, particularly when used in thin-film and composite configurations that reduce material quantity requirements.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent utilizes thin-film MXene coatings and flexible composite structures that provide effective EMI shielding with minimal material consumption, significantly reducing the quantity of substance required compared to traditional metal shrouds and thereby reducing cost.

Inventive Principle:
Principle #30Flexible shells and thin films

3Weight of moving object

If polymer-matrix composites with conductive fillers are used, then weight is reduced, but EMI shielding effectiveness is insufficient

Engineering Contradiction:
ImproveweightVSAvoidEMI shielding effectiveness
Core Design Contradiction:
Weight of moving objectVSReliability

Solution Approach 1:

The patent changes the conductive filler material from traditional particles to two-dimensional MXene sheets, which have superior electrical conductivity and aspect ratio, enabling effective EMI shielding at lower filler loadings and thus maintaining weight reduction while improving shielding effectiveness.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent optimizes the composite material structure by using MXene-polymer composites with specific configurations that enhance the conductive network formation, achieving both lightweight properties and high EMI shielding effectiveness that traditional conductive filler composites cannot achieve.

Inventive Principle:
Principle #40Composite materials

4Reliability

If traditional EMI shielding materials are used, then EMI shielding is provided, but device size and complexity increase

Engineering Contradiction:
ImproveEMI shieldingVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs ultra-thin MXene films and coatings that provide effective EMI shielding in minimal thickness, integrating seamlessly into compact electronic devices without adding significant size or complexity.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses integrated MXene-polymer composite structures that combine shielding functionality with structural components, reducing the need for separate shielding elements and thereby decreasing overall device complexity and size.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

These materials achieve unexpectedly high EMI shielding effectiveness, outperforming most known materials except pure metals, with specific compositions like Ti3C2Tx and Mo2TiC2 exhibiting EMI shielding values up to 92 dB and 27 dB respectively, effectively blocking electromagnetic interference across a wide frequency range.

Implementation Method 1

The majority of MXenes have very high metallic conductivities... exceptional electrical conductivity... coating comprising a two-dimensional transitional metal carbide, nitride, or carbonitride composition having electrically conductive surfaces

Methodology Applied
Scientific EffectElectrical conductivity: Conduction (electrical)

Data Source

PatentUS20240365522A1Two-dimensional metal carbide, nitride, and carbonitride films and composites for EMI shielding
Publication Date: 2024.10.31 KOREA INST OF SCI & TECH
  • US20240365522A1 patent drawing
  • US20240365522A1 patent drawing
  • US20240365522A1 patent drawing

AI summary

The present disclosure is directed to materials which provide electromagnetic shielding and methods of providing such electromagnetic shielding. In particular, the present disclosure describes the use of two-dimensional transition metal carbide, nitride, and carbonitride materials for this purpose.