NAND Flash Memory Concurrent Operation Control

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Solution Overview

Problem

Conventional methods for operating multiple NAND flash memory chips stacked in a package require sequential completion of operations, leading to prolonged program, erase, or read times as each chip is driven only after the previous one has finished.

Innovation Solution

A method where operation commands and addresses are sequentially applied to NAND flash memory chips without waiting for the previous chip's operation to complete, checking completion times, and adjusting addresses as necessary to ensure simultaneous operation across all chips.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If sequential operation method is used for multiple NAND flash memory chips, then operation simplicity is maintained, but overall operating time increases significantly

Engineering Contradiction:
Improveoperation simplicityVSAvoidoverall operating time
Core Design Contradiction:
Ease of operationVSLoss of time

Solution Approach 1:

The memory controller applies operation commands and addresses to multiple flash memory chips in advance, before previous operations complete. This preliminary action enables overlapping of operations across different chips, reducing total operating time while maintaining simple sequential command application structure

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system continuously applies operations to different flash memory chips without idle waiting periods. When one chip completes its operation, the controller immediately transitions to checking completion status of other chips or applying new commands, ensuring continuous productive action and eliminating wasted time

Inventive Principle:
Principle #20Continuity of useful action

2Reliability

If sequential completion method is used for program operations, then data integrity is ensured, but program time increases

Engineering Contradiction:
Improvedata integrityVSAvoidprogram time
Core Design Contradiction:
ReliabilityVSDuration of action of moving object

Solution Approach 1:

The system divides the flash memory storage into multiple independent chips that can operate simultaneously. Each chip handles specific data segments, allowing parallel program operations across different chips while maintaining data integrity through proper address management and completion checking

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The memory controller continuously monitors operation completion status of each flash memory chip through feedback signals. This feedback mechanism ensures that operations are properly coordinated and data integrity is maintained while enabling faster overall program time through parallel processing

Inventive Principle:
Principle #23Feedback

3Device complexity

If one chip is driven at a time, then control complexity is low, but productivity decreases

Engineering Contradiction:
Improvecontrol complexityVSAvoidprogram and erase performance
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The system merges multiple flash memory chips into a single controlled unit managed by one memory controller. This combining approach maintains low control complexity while significantly improving productivity by enabling simultaneous operations across multiple chips through coordinated command application and completion monitoring

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7502885B2Method of operating flash memory chips
Publication Date: 2009.03.10 SK HYNIX INC
  • US7502885B2 patent drawing
  • US7502885B2 patent drawing
  • US7502885B2 patent drawing

AI summary

A method of operating a packaged flash memory module includes applying a first program or erase command and a first address associated with the first commend to a first flash memory chip of a plurality of flash memory chips that are arranged within the packaged flash memory module; applying a second program or erase command and a second address associated with the second commend to a second flash memory chip of the plurality of flash memory chips that are arranged within the packaged flash memory module, the second command being applied to the second flash memory chip prior to the completion of the first command by the first flash memory chip; and determining whether or not the first flash memory chip has completed the first command.