NAND Flash Memory Reuse by Wire Separation and Substrate Transfer
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Solution Overview
Problem
The economic inefficiency and environmental impact of discarding entire managed NAND flash memory devices due to defective components, as existing technologies do not allow for the effective reuse of functional NAND flash memory units.
Innovation Solution
A method involving etching a portion of the substrate to expose and divide the connecting wire between the NAND flash memory and memory controller, allowing the NAND flash memory to be connected to a new substrate, thereby enabling the reuse of functional NAND flash memory units without the memory controller.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire managed NAND flash memory device is discarded due to defective components, then the reliability of the memory system is maintained, but economic efficiency deteriorates and environmental impact worsens
Solution Approach 1:
The patent segments the managed NAND flash memory device into separate components: the NAND flash memory chip is detached from the defective memory controller substrate. This segmentation allows the functional memory chip to be reused with a new controller, resolving the contradiction by maintaining system reliability through proper component separation while improving economic efficiency through resource reuse.
Solution Approach 2:
The patent applies discarding and recovering by discarding only the defective memory controller substrate while recovering and reusing the functional NAND flash memory chip. The memory chip is extracted from the original device and connected to a new substrate with a replacement controller, thereby recovering valuable memory resources and reducing waste.
2Reliability
If the entire managed NAND flash memory device is discarded due to defective components, then the reliability of the memory system is maintained, but environmental impact worsens
Solution Approach 1:
The patent segments the managed NAND flash memory device into separate components: the NAND flash memory chip is detached from the defective memory controller substrate. This segmentation allows the functional memory chip to be reused with a new controller, resolving the contradiction by maintaining system reliability through proper component separation while improving economic efficiency through resource reuse.
Solution Approach 2:
The patent applies discarding and recovering by discarding only the defective memory controller substrate while recovering and reusing the functional NAND flash memory chip. The memory chip is extracted from the original device and connected to a new substrate with a replacement controller, thereby recovering valuable memory resources and reducing waste.
3Ease of manufacture
If the wire connecting NAND flash memory and memory controller is not divided, then the manufacturing process is simpler, but the ability to reuse functional memory units deteriorates
Solution Approach 1:
The patent applies extraction by removing the wire connecting the NAND flash memory chip from the original substrate using etching. This extraction enables the memory chip to be separated and transferred to a new substrate, achieving adaptability for reuse while maintaining reasonable manufacturing complexity through standardized etching processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the recycling and reuse of NAND flash memory devices, reducing economic waste and environmental impact by isolating defective components and reassigning functional memory units to new substrates, thus extending the lifespan of memory devices.
Implementation Method 1
etching a portion of a first substrate of the NAND flash memory device to expose a wire connecting the at least one NAND flash memory and the memory controller to each other
Implementation Method 2
dividing the wire into a first wire and a second wire by etching a first area of the etched first substrate
Data Source
AI summary
Provided is a method of processing a NAND flash memory device including at least one NAND flash memory and a memory controller configured to control the at least one NAND flash memory. The method includes etching a portion of a first substrate of the NAND flash memory device to expose a wire connecting the at least one NAND flash memory and the memory controller to each other, dividing the wire into a first wire and a second wire by etching a first area of the etched first substrate, and connecting, to a second substrate, the first wire to which the at least one NAND flash memory is connected.