Nano-Structured Ceramic Coating for Tool Holder Vibration Damping
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Solution Overview
Problem
Manufacturing machines experience vibrations that lead to noise, reduced accuracy, and tool wear, and existing vibration damping methods are either ineffective or damage the workpiece due to high temperatures and slow deposition rates.
Innovation Solution
A passive vibration damping approach using nano-structured ceramic coatings with a composite material layer, comprising a viscoelastic layer and a carbon nitride layer, applied via sub-nano and nano-structured materials to tool holders, effectively converting mechanical energy into heat through friction between domains, reducing vibrations and maintaining low workpiece temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vibration damping material is deposited using conventional methods, then vibration damping is achieved, but the deposition temperature is high which damages the workpiece structure and annealing
Solution Approach 1:
The patent changes the deposition temperature parameter from conventional high temperatures to low temperatures (below 100°C), enabling vibration damping material deposition without damaging the workpiece structure or annealing properties
Solution Approach 2:
The patent replaces conventional thermal deposition methods with a method that deposits vibration damping material at low temperatures, substituting the thermal field with a different deposition mechanism that does not rely on high temperature
2Reliability
If conventional deposition methods are used for vibration damping material, then damping layer is formed, but the deposition rate is slow reducing productivity
Solution Approach 1:
The patent changes the deposition process parameters to achieve a deposition rate of 50 micrometers per hour, significantly improving productivity while maintaining vibration damping layer quality
3Productivity
If tool holder vibrates during operation, then machining process continues, but accuracy of work piece decreases and noise increases
Solution Approach 1:
The patent applies vibration damping material to the tool holder before machining operations, creating a cushioning layer that prevents vibration from affecting machining accuracy and reducing noise during operation
4Productivity
If cutting inserts are used without vibration damping, then chip removal is efficient, but insert life time is short due to shocks and vibration
Solution Approach 1:
The patent applies vibration damping material to the insert holder before inserting the cutting insert, creating a cushioning effect that reduces shocks and vibrations, thereby extending insert life time while maintaining chip removal efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances vibration damping capabilities, improving tool accuracy, extending tool life, and reducing noise, while maintaining the workpiece's integrity and allowing for higher production efficiency without the need for additional rigid layers or high temperatures.
Implementation Method 1
A vibration-damping material, comprising a ceramic material is provided. The ceramic material is present as a layer on the surface of the tool holder wherein the layer is from 1 μm to 1 cm
Implementation Method 2
Damping capacity of the materials relates to the ability to convert mechanical vibration energy into thermal energy by internal friction between domains or phases boundary
Implementation Method 3
The ceramic material is precipitated as a thin layer on the surface of the tool holder
Data Source
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AI summary
The present invention provides an appliance for chip removal applications comprising a vibration-damping material wherein the vibration-damping material is a material arranged by nano-dimensional cluster form. The present invention additionally provides a method for manufacturing said appliance. The present invention provides also an appliance obtainable by said method. Additionally the present invention provides an article or work piece for use in an appliance for chip removal applications. Also a computer program is provided for controlling the above method.