Nano-Heat Pipe Cooling for High Heat Flux Electronics
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Solution Overview
Problem
Current thermal management solutions for electronic components are inadequate in efficiently removing significant heat flux while being easy to implement, particularly for next-generation high-performance electronics that require effective cooling to prevent premature failure.
Innovation Solution
A cooling device with nano- or micro-channels embedded in a substrate, connected to a reservoir and filled with a coolant capable of reversible liquid to vapor transition, which forms vapor bubbles to passively remove heat from electronic components through evaporation and condensation, leveraging reduced liquid pressure for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cooling methods are used, then the device structure is simple and easy to implement, but the heat flux removal capability is insufficient for high-performance electronics
Solution Approach 1:
The patent utilizes phase transition of the coolant from liquid to vapor and back to liquid within the nano-channels. The coolant absorbs heat during vaporization at the heated region and releases heat during condensation at the cooler region, enabling efficient heat flux removal of at least 1000 W/cm2 through passive phase-change heat transfer mechanisms
Solution Approach 2:
The cooling device operates passively without external control systems. The phase change process automatically responds to temperature gradients, with the coolant naturally evaporating at hot regions and condensing at cooler regions, creating a self-regulating thermal management system that eliminates the need for active control mechanisms
2Ease of operation
If passive cooling is implemented, then the device operation is simplified, but the heat removal efficiency must be sufficient for significant heat flux
Solution Approach 1:
The patent employs phase transition of the coolant (liquid to vapor and back) within the nano-channels to achieve passive heat removal. The phase change process occurs automatically in response to temperature gradients, with vaporization absorbing heat at the heated region and condensation releasing heat at the cooler region, enabling efficient passive heat flux removal of at least 1000 W/cm2
3Reliability
If nano-channels are used, then the heat transfer efficiency is significantly improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes a porous substrate containing an array of interconnected nano-channels with dimensions of 10-100 nanometers. The porous structure provides high surface area to volume ratio and numerous heat transfer pathways, enabling efficient heat flux removal while the porous fabrication process is more tolerant to manufacturing variations compared to precise channel patterning
Solution Approach 2:
The patent specifies channel dimensions in the range of 10-100 nanometers, which provides optimal balance between heat transfer efficiency and manufacturing feasibility. This parameter range enables sufficient heat transfer performance while being achievable with current nanofabrication techniques, resolving the contradiction between heat transfer efficiency and manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes heat flux of at least 1000 W/cm2, providing improved thermal management by integrating the cooling device with the electronic component or positioning it against the heat source, enhancing the reliability and performance of electronic devices.
Implementation Method 1
nucleation occurs inside the embedded channels that are exposed to the heat source to form an elongated vapor bubble in each affected channel. Each vapor bubble and corresponding channel acts as a passive heat pipe to remove the heat from the heat source via the evaporation of liquid into the bubble
Implementation Method 2
condensation of vapor near the cooler ends of the bubble
Implementation Method 3
Cooler liquid is passively delivered to the heated region (where evaporation is occurring) by the reduced liquid pressure occurring in the thin film present between the bubble and the walls of the channel
Implementation Method 4
Each vapor bubble and corresponding channel acts as a passive heat pipe to remove the heat from the heat source
Data Source
AI summary
A cooling device for a heat source, such as an electronic component, has a single or set of nano- and/or micro-sized channel(s) connected to a single or multiple reservoir(s). The heat source causes nucleation within a channel, and a vapor bubble forms removing heat from the heat source via evaporation of liquid to vapor in the bubble and condensation of the generated vapor at the cooler ends of the bubble. Thus, the channel operates as a passive heat pipe and removes heat from the source by passively circulating the cooling fluid between the vapor bubble and the reservoir(s).