Nano-ink Transfer Method for Conductive Structures on Heat-Sensitive Substrates
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Solution Overview
Problem
Existing methods for producing electrical conductor structures on non-temperature-stable substrates like plastic foils or paper-based materials face challenges such as poor conductivity, high material consumption, and difficulty in achieving thin, flat conductor structures due to limitations in processing temperatures.
Innovation Solution
The use of nano-inks with metallic nanoparticles, which are sintered on a temperature-stable intermediate carrier and then transferred onto the final non-temperature-stable carrier material, allowing for improved conductivity and reduced material consumption by forming conductor structures that are thinner and more conductive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional printing paste with metallic particles is used to produce conductor structures on non-temperature-stable substrates, then the substrate can be processed without high temperature, but the electrical conductivity is poor and material consumption is high
Solution Approach 1:
The invention changes the particle size parameter of the metallic particles from conventional micrometer scale to nanometer scale (1-100 nm). This parameter change enables the particles to sinter at lower temperatures while achieving better electrical conductivity and requiring less material to form continuous conductive paths.
Solution Approach 2:
The invention uses composite material structure by combining metallic nanoparticles with organic vehicle and optional binders to create nano-inks. This composite approach allows the metallic particles to be suspended and applied uniformly while maintaining their nanoscale properties that enable low-temperature sintering and high conductivity.
2Reliability
If high temperature processing is used to improve conductivity through sintering, then electrical conductivity improves, but non-temperature-stable substrates like plastic foils and paper-based materials cannot be processed
Solution Approach 1:
The invention changes the sintering temperature parameter from conventional high temperatures (above substrate degradation point) to low temperatures (below substrate degradation point, typically 50-150°C). This is achieved by using nanoscale metallic particles that have lower sintering temperatures due to their high surface area to volume ratio and increased surface atom mobility.
Solution Approach 2:
The invention introduces an intermediary approach by first forming the conductor structure on a temperature-stable intermediate carrier at high temperature, then transferring it to the non-temperature-stable final carrier. This two-step process allows the benefits of high-temperature sintering while protecting the heat-sensitive final substrate.
3Ease of manufacture
If conventional conductor structures are produced on non-temperature-stable substrates, then processing temperature is limited, but the conductor structures become thicker and less flat
Solution Approach 1:
The invention changes the scale parameter of metallic particles to nanometer dimensions, which enables formation of thinner conductor structures. The nanoscale particles can pack more densely and sinter into thinner, flatter conductive paths compared to conventional micrometer-scale particles, achieving better manufacturing precision while maintaining low processing temperatures.
4Reliability
If nano-inks with metallic nanoparticles are sintered at high temperature, then electrical conductivity comparable to solid materials is achieved, but non-temperature-stable substrates cannot withstand the processing temperature
Solution Approach 1:
The invention applies preliminary action by first depositing the nano-ink pattern on a temperature-stable intermediate carrier, then sintering it at high temperature to achieve optimal conductivity. After sintering, the completed conductor structure is transferred to the final non-temperature-stable substrate. This preliminary sintering on a heat-resistant carrier allows high-temperature processing without exposing the heat-sensitive final substrate to damaging temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves conductor structures with electrical conductivity comparable to 20-50% of solid materials, enabling the production of thin, flat, and conductive paths on non-temperature-stable substrates with reduced processing time and lower material costs.
Implementation Method 1
The transfer material having the precursor conductor structures is dried and then subjected to a sintering process
Implementation Method 2
a) A nano-ink is printed onto a surface of the transfer material in a shape corresponding to a shape of the desired conductor structures
Data Source
AI summary
A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.