Nano-Metallic Layer Grounding for Wireless Devices

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Solution Overview

Problem

Conventional wireless communication devices with grounding metal housings are limited in design improvements due to technical prejudice, and there is a need for a thinner and more efficient configuration that addresses dust and moisture resistance while eliminating external grounding metal housings.

Innovation Solution

A wireless communication device design featuring a communication module with a circuit board, communication chip, passive components, and an insulating sheet, covered by a dust and moisture-resistant adhesive and a nano-metallic layer that replaces the external grounding metal housing, providing electromagnetic shielding and reducing device thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a grounding metal housing is used in conventional wireless communication devices, then electromagnetic shielding is provided, but device thickness increases and design flexibility is reduced

Engineering Contradiction:

Improveelectromagnetic shieldingVSAvoiddevice thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent extracts the grounding metal housing from the device structure and replaces it with a nano-metallic layer that provides equivalent electromagnetic shielding functionality. This extraction eliminates the thick metal housing while maintaining the essential shielding function through advanced nanomaterial properties.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the physical parameters of the shielding material from conventional metal thickness to nanoscale thickness. By using a nano-metallic layer with thickness in the nanometer range, the device achieves the same electromagnetic shielding performance with dramatically reduced thickness, directly resolving the contradiction between shielding effectiveness and device thickness.

Inventive Principle:

Principle #35Parameter changes

2Strength

If a grounding metal housing is used, then structural support is provided, but dust and moisture resistance is insufficient

Engineering Contradiction:

Improvestructural supportVSAvoiddust and moisture resistance

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent employs composite material structures including the nano-metallic layer combined with adhesive layers and insulating sheets. This composite approach provides both structural support and environmental protection, as each layer contributes specific properties: the nano-metallic layer for shielding and barrier properties, adhesive layers for bonding and sealing, and insulating sheets for electrical isolation and additional protection against dust and moisture.

Inventive Principle:

Principle #40Composite materials

3Adaptability or versatility

If passive components are mounted on the circuit board, then functional requirements are met, but tracking and identification of components becomes difficult

Engineering Contradiction:

Improvefunctional requirementsVSAvoidcomponent tracking

Core Design Contradiction:

Adaptability or versatilityVSDifficulty of detecting and measuring

Solution Approach 1:

The patent utilizes the insulating sheet with tracking surface that can display visual information about passive components. This visual tracking system allows operators to easily identify and locate specific components on the circuit board, solving the difficulty of component detection and measurement while maintaining full functional requirements.

Inventive Principle:

Principle #32Color changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively replaces the conventional grounding metal housing with a nano-metallic layer, enhancing dust and moisture resistance, reducing device thickness, and enabling the display of information related to passive components, while maintaining electromagnetic shielding.

Implementation Method 1

The nano-metallic layer covers and is connected to the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet. The nano-metallic layer is electrically coupled to the grounding portion.

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

The dust and moisture resistant adhesive covers and is connected to any electrically conductive portions of the communication module on the carrying surface.

Methodology Applied

Scientific EffectAdhesion and barrier protection: Adhesive

Data Source

PatentUS11309626B2Wireless communication device

Publication Date: 2022.04.19 AZUREWAVE TECHNOLOGIES INC

AI summary

A wireless communication device is provided and includes a communication module, a dust and moisture resistant adhesive, and a nano-metallic layer. The communication module includes a circuit board, a communication chip and a plurality of passive components mounted on a carrying surface of the circuit board, and an insulating sheet that is disposed on the passive components and that has a thickness smaller than or equal to 150 μm. The dust and moisture resistant adhesive covers any electrically conductive portions of the communication module on the carrying surface. The nano-metallic layer covers the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, and is electrically coupled to a grounding portion of the circuit board. The wireless communication device does not include any grounding metal housing mounted on the circuit board.