Nano/Micro Structure Substrate Manufacturing via Auxiliary Carrier
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Solution Overview
Problem
Existing methods for manufacturing substrates with nano/micro structures face challenges in achieving minimized surface roughness, high reliability, flexibility, transparency, and conductivity, while also minimizing damage to the substrate and ensuring uniform sheet resistance.
Innovation Solution
A method involving the formation of nano/micro structures on an auxiliary substrate, followed by coating a base solution and performing heat treatment to fuse and bond the structures, then removing the auxiliary substrate to create a flat base substrate with integrated nano/micro structures, along with a refining process using a mixed solution and centrifuge to collect structures of similar mass and size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro/nano structures are manufactured by chemical methods and coated on substrate, then various sizes and properties can be achieved, but surface roughness increases and manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct stages: forming nano/micro structures on an auxiliary substrate, coating the base solution, heat treatment to fuse structures, and finally removing the auxiliary substrate. This segmentation allows each step to be optimized independently, achieving smooth surfaces while managing process complexity systematically
Solution Approach 2:
An auxiliary substrate is introduced as an intermediary carrier to form nano/micro structures before transferring them to the final base substrate. This intermediary approach enables precise structure formation and subsequent heat treatment without directly complicating the final substrate manufacturing process, resulting in minimized surface roughness
2Reliability
If heat treatment, acid steam treatment, or graphene oxide treatment is performed after coating to reduce resistance, then conductivity improves, but micro/nano structures or substrate are damaged
Solution Approach 1:
The base solution is coated and heat treated to fuse nano/micro structures into a network before any conductivity-enhancing treatments are applied. This preliminary formation of a robust structural network provides a foundation that can withstand subsequent conductivity treatments without damage to the underlying substrate or structures
Solution Approach 2:
The auxiliary substrate serves as a cushioning support during the heat treatment process, allowing structures to be fused and bonded without directly exposing the final substrate to damaging high temperatures. This prior cushioning protects the substrate while still achieving the desired conductivity through controlled heat treatment
3Reliability
If uniform-sized micro/nano structures are manufactured, then conductivity and transmittance improve, but manufacturing precision requirements increase
Solution Approach 1:
The heat treatment process utilizes controlled temperature and time parameters to fuse and bond nano/micro structures into a uniform network. By carefully adjusting these parameters, structures of consistent size and distribution are achieved, improving conductivity and transmittance while managing the precision requirements through process control rather than solely relying on precise structure formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in substrates with minimized surface roughness, high reliability, and uniform sheet resistance, while maintaining conductivity and flexibility, and reduces substrate damage during the manufacturing process.
Implementation Method 1
forming a base substrate configured to cover the nano/micro structures by performing a heat treatment to the base solution
Implementation Method 2
at least parts of the nano/micro structures may be fused and bonded to each other
Implementation Method 3
a refining process using a mixed solution and centrifuge to collect structures of similar mass and size
Data Source
AI summary
Provided is a manufacturing method for a substrate having a microstructure. The manufacturing method for a substrate having a microstructure comprises the steps of: forming a microstructure on the upper surface of an auxiliary substrate; coating a base solution on the microstructure; forming a base substrate covering the microstructure by heattreating the base solution; and removing the auxiliary substrate from the base substrate.