Organic-Inorganic Nanocomposite Polishing Particles for CMP
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Solution Overview
Problem
Existing chemical mechanical polishing (CMP) solutions face challenges in achieving high polishing rates while maintaining surface flatness and minimizing defects such as scratches, due to limitations in the surface engineering of polishing particles.
Innovation Solution
The method involves preparing organic-inorganic nanocomposite particle dispersions by alternately adding anionic and cationic organic polymers to inorganic nanocomposite particles, resulting in particles with adjustable surface charge properties. This process creates a soft organic shell around hard inorganic cores, enhancing the polishing solution's performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional polishing particles are used, then the polishing rate can be maintained, but surface flatness deteriorates and defects such as scratches increase
Solution Approach 1:
The patent applies composite materials by combining inorganic nanocomposite particles with organic polymers to create organic-inorganic nanocomposite particles. This composite structure allows the inorganic core to provide polishing capability while the organic shell controls surface interaction, thereby achieving both high polishing rate and improved surface flatness without excessive scratches
Solution Approach 2:
The patent implements local quality by creating particles with heterogeneous structure where the inorganic core and organic shell have different properties. The core maintains hardness for polishing while the shell provides surface engineering properties that control interaction with the polished surface, enabling different regions of the particle to fulfill different functions for simultaneous productivity and precision improvement
2Productivity
If polishing particles with high polishing rate are used, then productivity improves, but the degree of defects increases
Solution Approach 1:
The patent uses flexible shells by coating the inorganic particle core with organic polymer shells that can deform and adapt during polishing contact. This flexible shell acts as a cushion between the hard core and the polished surface, reducing mechanical stress concentration that causes scratches and defects while maintaining the core's polishing effectiveness
Solution Approach 2:
The patent converts potentially harmful sharp edges and irregular surfaces of inorganic particles into beneficial features by coating them with organic shells. The shell softens the particle surface, transforming what would be scratch-causing sharp features into smooth contact surfaces that reduce defects while preserving the underlying polishing capability
3Adaptability or versatility
If surface engineering modification of polishing particles is performed, then polishing solution performance can be adjusted, but device complexity increases
Solution Approach 1:
The patent applies parameter changes by systematically varying organic polymer parameters including type (anionic, cationic, nonionic), molecular weight, concentration, and coating sequence to achieve desired polishing performance. This parameter-based approach allows flexible adjustment of polishing solution characteristics while using standardized preparation procedures, balancing adaptability with process manageability
4Reliability
If multiple layers of organic polymers are coated on inorganic particles, then polishing performance is optimized, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the surface modification into discrete sequential steps, each adding a specific organic polymer layer with defined characteristics. This segmented approach allows control over each layer's properties and thickness while maintaining a systematic, repeatable manufacturing process that balances performance optimization with ease of execution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach significantly improves the polishing rate of silicon oxide, reduces defects like scratches, and allows for the customization of polishing abrasives according to CMP fluid requirements, thereby enhancing the overall CMP process efficiency.
Implementation Method 1
adding anionic organic polymers to the positively charged inorganic nanocomposite particle dispersion
Implementation Method 2
adding cationic organic polymers to the dispersion of negatively charged organic polymer inorganic metal oxide composites
Implementation Method 3
the dispersion method comprises one or more of ultrasonic dispersion treatment
Implementation Method 4
the dispersion method comprises one or more of ultrasonic dispersion treatment, high-speed shear treatment
Data Source
AI summary
The present disclosure provides a method for preparing an organic-inorganic nanocomposite particle dispersion, comprising: preparing a negatively charged organic-inorganic nanocomposite particle dispersion: adding positively charged inorganic nanoparticles to an anionic organic polymer solution, stirring thoroughly, dispersing uniformly, and obtaining a negatively charged organic-inorganic nanocomposite particle dispersion; preparing a positively charged organic-inorganic nanocomposite particle dispersion: adding a negatively charged organic polymer inorganic metal oxide composite dispersion to a cationic organic polymer solution, stirring thoroughly, and dispersing uniformly to obtain a positively charged organic polymer inorganic nanocomposite particle dispersion; repeating step (1) and (2) alternately to obtain a dispersion of negatively charged and positively charged organic-inorganic nanocomposites by adjusting the number of step (1) and (2), respectively. Through the above methods, effective control of CMP polishing fluid performance can be achieved.