Nanograin Tungsten Wire for High-Strength Industrial Diameters

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing tungsten wires lack the necessary tensile strength for applications beyond medical needles, despite tungsten's high chemical stability and elastic modulus, limiting their industrial potential.

Innovation Solution

A tungsten wire with an average surface crystal grain width of at most 98 nm, a diameter between 100 μm and 225 μm, and a tensile strength of at least 3900 MPa, achieved through controlled processing including heat and room temperature drawing, is developed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If tungsten wire diameter is increased for industrial applications, then mechanical strength and stability improve, but achieving high tensile strength becomes more difficult

Engineering Contradiction:
Improvetensile strengthVSAvoidsurface crystal grain width control
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by precisely controlling the surface crystal grain width to at most 98 nm through adjusted processing parameters during wire drawing. This nanoscale grain control enables the tungsten wire to achieve tensile strength of at least 3900 MPa while maintaining industrial application diameters (100-225 μm), resolving the contradiction between diameter increase and strength achievement.

Inventive Principle:
Principle #35Parameter changes

2Length of moving object

If tungsten wire diameter is reduced for finer applications, then flexibility and precision improve, but tensile strength decreases

Engineering Contradiction:
Improvewire diameterVSAvoidtensile strength
Core Design Contradiction:
Length of moving objectVSStrength

Solution Approach 1:

The patent uses parameter changes by implementing specific processing conditions during wire drawing that control surface crystal grain width to at most 98 nm. This enables the production of thin tungsten wires (100-225 μm diameter) while maintaining exceptional tensile strength of at least 3900 MPa, overcoming the typical strength loss associated with reduced diameter.

Inventive Principle:
Principle #35Parameter changes

3Strength

If conventional tungsten wire processing is used, then manufacturing simplicity is maintained, but tensile strength remains insufficient for diverse industrial applications

Engineering Contradiction:
Improvetensile strengthVSAvoidprocessing complexity
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The patent applies parameter changes by modifying processing conditions during wire drawing, specifically controlling surface crystal grain width to at most 98 nm through adjusted drawing parameters. This enables conventional manufacturing processes to produce tungsten wire with tensile strength of at least 3900 MPa, achieving high strength without requiring fundamentally new manufacturing methods.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The tungsten wire exhibits significantly higher tensile strength than conventional piano wires, enabling applications in saw wires and screen printing, while allowing for thinner diameters without breaking, and can be industrially produced in long lengths.

Implementation Method 1

heat and room temperature drawing

Methodology Applied
Scientific EffectHeat drawing: Heating

Implementation Method 2

heat and room temperature drawing

Methodology Applied
Scientific EffectRoom temperature drawing: Deformation

Implementation Method 3

an average width of surface crystal grains in a direction perpendicular to an axis of the tungsten wire is at most 98 nm, a tensile strength of the tungsten wire is at least 3900 MPa

Methodology Applied
Scientific EffectGrain boundary strengthening: Grain Boundary Strengthening

Data Source

PatentUS12398447B2Tungsten wire, saw wire, and tungsten wire for screen printing
Publication Date: 2025.08.26 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US12398447B2 patent drawing
  • US12398447B2 patent drawing
  • US12398447B2 patent drawing

AI summary

A tungsten wire that contains tungsten or a tungsten alloy is provided. An average width of surface crystal grains in a direction perpendicular to an axis of the tungsten wire is at most 98 nm. The tungsten wire has a tensile strength of at least 3900 MPa. The tungsten wire has a diameter of at least 100 μm and at most 225 μm.