Nanoimprint Patterning via Dual-Curing Agents

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Solution Overview

Problem

In the nano-imprint process for manufacturing semiconductor devices, the resin material often adheres to or is deformed when stripped from the template due to frictional forces, leading to pattern destruction and non-uniform curing.

Innovation Solution

A method involving an uncured imprint material with two types of curing agents, where the first agent reacts upon pressing the template to create a semi-cured state that prevents adhesion and deformation, followed by full curing to form a stable resin pattern, using either light-sensitive or thermally sensitive materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the template is stripped from the resin material after curing, then the pattern is transferred to the resin material, but the resin material adheres to the template and the pattern may be torn off or deformed due to large frictional force

Engineering Contradiction:

Improvepattern integrityVSAvoidfrictional force

Core Design Contradiction:

Manufacturing precisionVSForce

Solution Approach 1:

The curing process is segmented into two distinct stages: first curing while the template is pressed (creating semi-cured state with low adhesion), and second curing after template removal (achieving full mechanical properties). This segmentation allows the pattern to be formed without adhesion forces, eliminating the friction problem that would otherwise destroy the pattern.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first curing action is performed preliminarily while the template is still in place, creating a semi-cured state that prevents adhesion. This preliminary curing establishes the pattern structure before the template is removed, avoiding the frictional forces that would occur if curing happened after removal.

Inventive Principle:

Principle #10Preliminary action

2Stability of the object's composition

If the resin material is cured completely before template removal, then the pattern structure is stable, but the resin material adheres strongly to the template making removal difficult and causing pattern destruction

Engineering Contradiction:

Improvepattern stabilityVSAvoidtemplate removal ease

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The curing process is divided into two segments: first curing to a semi-cured state (providing enough stability to prevent adhesion) while the template is pressed, then completing the curing after template removal. This segmentation resolves the contradiction by providing just enough stability at each stage without the drawbacks of either complete curing before or after removal.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The curing degree parameter is changed in two steps: first to a semi-cured state (intermediate curing level) for template removal, then to fully cured state for final stability. This parameter change strategy allows optimization of both adhesion prevention and pattern stability at different stages.

Inventive Principle:

Principle #35Parameter changes

3Ease of operation

If the resin material is kept in uncured state during template pressing, then adhesion and deformation are prevented, but the pattern lacks mechanical strength and stability

Engineering Contradiction:

Improvetemplate stripping easeVSAvoidresin pattern strength

Core Design Contradiction:

Ease of operationVSStrength

Solution Approach 1:

The curing process is segmented into first curing (providing operational ease during template pressing and removal) and second curing (providing final mechanical strength). This segmentation allows the resin to be easy to operate with during the critical template removal stage while still achieving the necessary strength in the final product.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures the preservation of fine patterns during template stripping and achieves uniform curing, enhancing the etching resistance and integrity of the resin pattern for semiconductor device manufacturing.

Implementation Method 1

reacting the first curing agent with the template pressed against the imprint material

Methodology Applied

Scientific EffectCuring reaction: Photopolymerisation

Implementation Method 2

reacting the second curing agent

Methodology Applied

Scientific EffectCuring reaction: Photopolymerisation

Implementation Method 3

irradiating the imprint material with light of a wavelength of 365 nm... causing the first photosensitive material to react

Methodology Applied

Scientific EffectPhotochemical reaction: Photopolymerisation

Data Source

PatentUS8551393B2Patterning method and method for manufacturing semiconductor device

Publication Date: 2013.10.08 KIOXIA CORP

AI summary

In one embodiment, a patterning method is disclosed. The method includes applying an uncured imprint material containing a first curing agent and a second curing agent onto a substrate. The method includes pressing a template against the imprint material. The method includes reacting the first curing agent with the template pressed against the imprint material. The method includes stripping the template from the imprint material. In addition, the method includes reacting the second curing agent.