Photo-nanoimprint Lithography Substrate with Printing Plate Coating

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Solution Overview

Problem

Conventional methods for producing substrates with fine projection-and-recess patterns, such as spin-coating and ink-jet printing, face issues with non-uniform residual layers, low pattern feature size, and accuracy due to low viscosity photocurable compositions, which lead to poor productivity and quality.

Innovation Solution

A method using a printing plate to apply a high viscosity photocurable composition to a substrate, followed by molding with a fine patterned mold, curing, and subsequent etching steps, ensuring uniform application and reducing solvent content, thereby enhancing pattern accuracy and productivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a low viscosity photocurable composition is used to fill gaps in photo-nanoimprint lithography, then the composition can be easily applied and cured, but the residual layer thickness becomes non-uniform and pattern feature size and accuracy deteriorate

Engineering Contradiction:
Improveease of composition applicationVSAvoidpattern feature size and accuracy
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent changes the viscosity parameter of the photocurable composition from low (conventional) to high (new invention). This parameter change prevents the composition from penetrating into mold projections during application, ensuring uniform residual layer thickness and improving pattern feature size and accuracy while maintaining ease of application through the printing plate method

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces a printing plate as an intermediary between the composition supply and the substrate. The printing plate with its mesh structure controls the composition flow, allowing easy application while preventing excessive penetration into mold projections, thus resolving the contradiction between ease of operation and manufacturing precision

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If spin-coating is used to apply photocurable composition, then uniform coating can be achieved, but composition is applied to unnecessary portions and residual layer thickness becomes non-uniform

Engineering Contradiction:
Improvecoating uniformityVSAvoidwaste of photocurable composition
Core Design Contradiction:
Manufacturing precisionVSLoss of substance

Solution Approach 1:

The patent applies photocurable composition only to necessary portions of the substrate through the printing plate's mesh structure. This local quality approach ensures uniform coating where needed while preventing waste on unnecessary portions, resolving the contradiction between coating uniformity and substance loss

Inventive Principle:
Principle #3Local quality

3Loss of substance

If ink-jet printing is used to apply photocurable composition, then composition can be applied to proper portions, but the application process takes time and productivity decreases

Engineering Contradiction:
Improveprecise composition applicationVSAvoidproduction speed
Core Design Contradiction:
Loss of substanceVSProductivity

Solution Approach 1:

The patent merges the advantages of precise application (like ink-jet) with high-speed coating (like spin-coating) by using a printing plate with mesh structure. This allows composition to be applied to proper portions through the mesh openings while maintaining high productivity through continuous printing processes, resolving the contradiction between precise application and production speed

Inventive Principle:
Principle #5Merging (Combining)

4Ease of operation

If low viscosity photocurable composition is used, then the composition flows easily during application, but solvent content increases and environmental impact increases

Engineering Contradiction:
Improvecomposition flowabilityVSAvoidsolvent emissions
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The patent changes the viscosity parameter to high, which correlates with reduced solvent content. The high viscosity prevents excessive flow during application while simultaneously reducing volatile organic compound emissions, resolving the contradiction between ease of operation and environmental harm

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves improved pattern feature size and accuracy, increased productivity, and reduced solvent usage, resulting in a substrate with a fine projection-and-recess pattern that is cost-effective and environmentally friendly.

Implementation Method 1

irradiating the photocurable composition with light to cure the photocurable composition

Methodology Applied
Scientific EffectPhotocuring: Photopolymerisation

Data Source

PatentUS10613433B2Method for producing substrate with fine projection-and-recess pattern, and substrate with fine projection-and-recess pattern obtained thereby
Publication Date: 2020.04.07 TOHOKU UNIV
  • US10613433B2 patent drawing
  • US10613433B2 patent drawing
  • US10613433B2 patent drawing

AI summary

A method for producing a substrate with a fine projection-and-recess pattern which is excellent in productivity and achieves excellent pattern feature size and accuracy is provided. The method for producing a substrate with a fine projection-and-recess pattern 50 by photo-nanoimprint lithography includes: a first step S1 of applying a photocurable composition 2 to a substrate 1 to form a composition-applied substrate 10; a second step S2 of pressing a mold 20 provided with a fine projection-and-recess pattern into contact with the composition-applied substrate 10 to mold the photocurable composition 2 into recesses 5a and projections 5b; a third step S3 of irradiating the photocurable composition 2 with an active energy line to cure the photocurable composition 2 of the recesses 5a and the projections 5b and peeling off the mold 20; a fourth step S4 of removing the cured recesses 5a and etching the substrate 1 located on the lower surface of the recesses 5a; and a fifth step S5 of removing the cured projections 5b. At the first step S1, the photocurable composition 2 is applied to the substrate 1 by printing using a printing plate.