Photo-nanoimprint Resist Filling Speed via Dual Composition
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Solution Overview
Problem
The photo-nanoimprint technology faces a challenge with a long filling time, resulting in low throughput due to the time required for the mold to spread and fill the resist, which hampers the efficiency of pattern formation in semiconductor devices and other microfabrication processes.
Innovation Solution
A pattern forming method is developed that involves using two curable compositions, where one composition is applied as a layer on the substrate and the other is dispensed dropwise, with a low contact angle of the composition with respect to the mold, allowing for quick spreading and filling by optimizing the surface tension and viscosity, and subsequent curing with light irradiation to reduce the filling time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a photocurable composition is dispensed dropwise and spread by capillary phenomenon to fill the mold groove pattern, then the pattern can be formed on the substrate, but the filling time becomes long and throughput decreases
Solution Approach 1:
The patent changes the physical parameters of the photocurable composition, specifically adjusting surface tension and viscosity to optimize the balance between filling capability and filling time. By controlling these parameters, the composition fills the mold pattern quickly while maintaining complete filling, thus improving throughput without sacrificing pattern formation precision
Solution Approach 2:
The patent introduces a two-stage dynamic process: first, the photocurable composition is dispensed and spreads dynamically by capillary phenomenon to fill the mold pattern quickly; second, light irradiation cures the composition to fix the pattern. This dynamic approach transforms the slow static filling process into a fast dynamic process followed by rapid curing
2Manufacturing precision
If the resist is allowed to spread over the entire region of the gap between substrate and mold, then complete filling is achieved, but the spreading time increases and reduces efficiency
Solution Approach 1:
The patent optimizes the surface tension and viscosity parameters of the photocurable composition to achieve the right balance. The composition has sufficient流动性 to spread completely into the mold pattern but with controlled speed to minimize spreading time, resolving the contradiction between filling completeness and spreading time
3Manufacturing precision
If the contact angle of the composition with the mold surface is reduced to enhance wetting, then filling is improved, but the composition may spread too quickly causing loss of control
Solution Approach 1:
The patent precisely controls the contact angle by adjusting the surface tension of the photocurable composition. The composition achieves good wetting with the mold surface (contact angle of 10° or less) while maintaining controlled spreading behavior through optimized viscosity and surface tension parameters, thus improving filling without losing operational control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the filling time, enhancing throughput and productivity in pattern formation, enabling high-speed processing of microstructures with improved precision and reduced defects.
Implementation Method 1
the droplets of the resist 102 spread over the entire region of a gap between the substrate 101 and the mold 105... The phenomenon is called spread. In addition, in the mold contacting step, the resist 102 is filled into a groove portion on the mold 105... by the capillary phenomenon
Implementation Method 2
the curable composition (A1) is cured in a state in which a mold having a fine groove/land pattern formed on its surface is pressed against a substrate (wafer) having applied thereto the photocurable composition
Data Source
AI summary
A pattern is formed on a substrate with a layer of a curable composition (A1) containing a component (a1) serving as a polymerizable compound on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing at least a component (a2) serving as a polymerizable compound dropwise discretely onto the layer of the curable composition (A1), subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold having a pattern and the substrate, then irradiating the mixture layer with light to cure the layer, and releasing the mold from the mixture layer after the curing, a contact angle of a composition of components of the curable composition (A1) except a solvent of the curable composition (A1) with respect to a surface of the mold being 10° or less.