Nanoimprint Template Layout for Edge Pattern Deformation Control

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Solution Overview

Problem

In nanoimprint lithography, the separation of templates from semiconductor substrates often results in deformation of patterns due to stress-induced vibrations, particularly affecting protruding features at the edges of line-and-space patterns, which complicates the formation of desired patterns.

Innovation Solution

A pattern forming method using a template with recessed and protruding portions arranged to satisfy specific geometric relationships, including the formation of a dummy pattern near the ends of line-and-space patterns to reduce deformation by redistributing stress and preventing contact between protruding features during template separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a template is pressed against an imprint material to form a pattern, then the pattern is transferred to the imprint material, but stress-induced vibrations during template separation cause deformation of protruding features

Engineering Contradiction:
Improvepattern accuracyVSAvoidstress-induced vibration
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces dummy patterns (additional recessed portions) near the ends of line-and-space patterns before the actual patterning process. These dummy patterns are formed in advance to modify the stress distribution in the template, preventing stress-induced vibrations during template separation that would otherwise deform the actual patterns.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies different structural characteristics to different regions of the template. Specifically, dummy patterns are added only at the end regions of the line-and-space pattern, while the central regions maintain their original design. This localized modification targets the specific areas where stress concentration and vibration occur during separation, without affecting the overall pattern integrity.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the template structure is modified to reduce stress-induced vibration, then pattern deformation is reduced, but the template design becomes more complex

Engineering Contradiction:
Improvepattern accuracyVSAvoidtemplate design
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The dummy patterns are designed and formed in advance during template fabrication. By pre-introducing these additional recessed portions at strategic locations, the template's stress distribution is optimized before use, eliminating the need for complex real-time adjustments or sophisticated separation mechanisms during the patterning process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent modifies the template's geometric parameters by adding dummy patterns with specific dimensional relationships. The dummy patterns are designed with depth and spacing parameters that satisfy specific mathematical relationships (e.g., depth ratios, distance relationships) to optimally counteract stress-induced vibrations, transforming a complex vibration control problem into a parameter optimization problem.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively reduces deformation of protruding features and ensures accurate pattern transfer by minimizing stress-induced vibrations, allowing for the formation of precise semiconductor device patterns.

Implementation Method 1

pressing the template against the material to mold the imprint material

Methodology Applied
Scientific EffectMolding:

Implementation Method 2

The molded imprint material is then cured and the template removed

Methodology Applied
Scientific EffectCuring:

Data Source

PatentUS20240096644A1Pattern forming method, manufacturing method of semiconductor device, and semiconductor device
Publication Date: 2024.03.21 KIOXIA CORP
  • US20240096644A1 patent drawing
  • US20240096644A1 patent drawing
  • US20240096644A1 patent drawing

AI summary

According to one embodiment, a pattern forming method uses a template having a first region with a first recessed portion and a second region adjacent to the first region. The second region has a second recessed portion therein. The recessed portions satisfy a specific relationship (D1>2(H1+H2)/π), where D1 is a shortest distance between the first and second recessed portions, H1 is a depth of the first recessed portion, and H2 is a depth of the second recessed portion. The pattern forming method includes placing an imprint material on an object and pressing the template against the material to mold the imprint material. The molded imprint material is then cured, and the template removed.