Nanoimprint Lithography Template Protection via Surface Inspection
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Solution Overview
Problem
In nano-imprint lithography, the challenge lies in preventing template damage and pattern defects due to irregularities or foreign matter on the substrate surface, which hinders precise pattern transfer and increases the risk of template corruption.
Innovation Solution
A patterning method that involves forming an underlying film on a substrate, inspecting for surface irregularities or foreign matter, and using either a primary template for clean areas or a dummy template for areas with imperfections, allowing for controlled pattern transfer while preventing template damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a template is brought into contact with the substrate surface for pattern transfer, then pattern formation is achieved, but template damage or corruption occurs due to irregularity or foreign matter on the substrate surface
Solution Approach 1:
The substrate surface is inspected for irregularity and foreign matter before the template contact step. This preliminary inspection allows the system to identify problematic areas and avoid contacting the template with those regions, preventing template damage while enabling pattern transfer on clean areas.
Solution Approach 2:
The substrate surface is divided into multiple shot regions, and each region is inspected and evaluated independently. This segmentation allows selective processing where only regions without irregularity or foreign matter are subjected to template contact, isolating the template from harmful factors while maintaining productivity on acceptable regions.
2Reliability
If the substrate surface is inspected for irregularity and foreign matter before patterning, then template damage is prevented, but processing time increases due to additional inspection steps
Solution Approach 1:
The inspection process is merged with the existing patterning workflow by integrating it into the shot region preparation sequence. The inspection is performed on the same substrate in the same processing sequence, combining quality assurance with production operations to minimize additional time loss.
Solution Approach 2:
Regions identified as having irregularity or foreign matter are skipped during template contact, and processing continues rapidly on approved regions. This selective skipping approach maintains high productivity by avoiding time-consuming rework or complete process repetition while still preventing template damage.
3Productivity
If a corrupted template is used for continued processing, then productivity is maintained, but pattern defects are introduced due to template damage
Solution Approach 1:
By inspecting the substrate surface before template contact, the system proactively identifies and avoids regions that would cause template corruption. This preliminary protective action prevents template damage that would otherwise lead to pattern defects in subsequent processing, maintaining both productivity and quality.
Solution Approach 2:
The presence of irregularity or foreign matter on the substrate, which would normally be a harmful factor causing template damage, is converted into useful information through inspection. This information is used to guide selective processing, turning potential defects into opportunities for quality control and template protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise and efficient pattern formation by preventing template corruption and extending its lifespan, while ensuring accurate and defect-free pattern transfer on semiconductor substrates.
Implementation Method 1
the organic material is cured by irradiating light
Data Source
AI summary
A patterning method according to an embodiment of the present invention comprises: acquiring information about a surface state of an underlying film formed on a substrate; determining, based on the surface state, whether irregularity/foreign matter is present in each shot region in which a pattern is to be formed; and solidifying a resist agent while a first template, when it is determined that no irregularity/foreign matter is present in the shot region, or a second template that is different from the first template, when it is determined that irregularity/foreign matter is present in the shot region, is brought close to the underlying film on the shot region at a certain distance with the resist agent therebetween.