Nanoparticle Electrode Bonding for Damage-Free Display Subpixels

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing manufacturing process for display devices, as described in Patent Literature 1, involves forming electrodes directly on the functional layer by sputtering, which can damage the functional layer.

Innovation Solution

The proposed display device structure includes a plurality of subpixels with light-emitting elements, featuring a first substrate with first electrodes, a second substrate with a common second electrode, subpixel-specific layers, and a nanoparticle layer with a stack of nanoparticles between the electrodes, which includes cavities between adjacent subpixel-specific layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If electrodes are formed directly on the functional layer by sputtering, then the manufacturing process is simplified, but the functional layer is damaged

Engineering Contradiction:
Improveelectrode formation processVSAvoidfunctional layer integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A protective layer is introduced as an intermediary between the functional layer and the electrode formation process. This protective layer prevents direct contact between the sputtering process and the functional layer, thereby preventing damage while still allowing the electrode to be formed. The protective layer acts as a buffer that mediates the interaction between the manufacturing process and the sensitive functional layer.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the functional layer is protected during electrode formation, then the functional layer integrity is improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvefunctional layer integrityVSAvoidmanufacturing process structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The protective layer is merged with the electrode structure by forming the electrode directly on top of the protective layer. This integration means that the protective function and the electrode function are combined in a single structural arrangement, reducing the need for separate protective components and simplifying the overall manufacturing process despite the addition of the protective layer.

Inventive Principle:
Principle #5Merging (Combining)

3Manufacturing precision

If subpixel-specific layers are formed for each subpixel, then the display quality is improved, but the risk of short-circuiting between subpixels increases

Engineering Contradiction:
Improvesubpixel layer precisionVSAvoidshort-circuit risk
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The display structure is segmented into discrete subpixel units with isolated electrodes and subpixel-specific layers for each subpixel. This segmentation creates physical and electrical isolation between adjacent subpixels, preventing current leakage and short-circuiting while maintaining the precision of individual subpixel layers. Each subpixel operates as an independent unit with its own protective boundaries.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12279503B2Display device and method of manufacturing display device
Publication Date: 2025.04.15 SHARP KK
  • US12279503B2 patent drawing
  • US12279503B2 patent drawing
  • US12279503B2 patent drawing

AI summary

The provided method of manufacturing a display device includes a nanoparticle layer forming step and a bonding step. The nanoparticle layer forming step includes forming a nanoparticle layer including a stack of nanoparticles on either one or both of a topmost face of a first substrate including first electrodes, the first electrodes being provided on said topmost face, and a topmost face of a second substrate including a second electrode, the second electrode being provided on said topmost face. The bonding step includes bonding the first substrate and the second substrate together via the nanoparticle layer in such a manner that the first electrodes face the second electrode.