Nanoparticle Bonding Layers for IC Die Heat Dissipation
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Solution Overview
Problem
As semiconductor devices undergo miniaturization, effective heat dissipation becomes a challenge due to increased integration density, leading to performance and reliability issues.
Innovation Solution
The use of bonding layers with high thermal conductivity materials, such as metal oxides and nanoparticles like silver, ruthenium, or niobium, to directly bond an integrated circuit die to a support substrate, enhancing heat dissipation through dielectric-to-dielectric bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If minimum feature size is reduced to increase integration density, then more components can be integrated into a given area, but heat dissipation becomes ineffective leading to performance and reliability issues
Solution Approach 1:
The patent changes the thermal conductivity parameter of the bonding layer by incorporating high thermal conductivity materials (such as diamond, cubic boron nitride, or metal particles) into the bonding layer composition. This parameter change enables effective heat dissipation while maintaining the high integration density achieved through miniaturization
Solution Approach 2:
The bonding layer is formulated as a composite material combining dielectric materials with high thermal conductivity additives (diamond particles, cubic boron nitride, metal particles). This composite structure provides both the electrical insulation required for bonding and the thermal conduction necessary for heat dissipation
2Reliability
If bonding layers with high thermal conductivity materials are used to enhance heat dissipation, then heat transfer improves, but manufacturing complexity increases
Solution Approach 1:
The bonding layer is designed to perform multiple functions simultaneously: electrical insulation, mechanical bonding, and thermal conduction. By incorporating high thermal conductivity materials into the bonding layer itself, the patent eliminates the need for separate thermal management structures, thereby reducing overall device complexity while improving heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively transfers heat generated by the integrated circuit die to the substrate, improving performance and reliability by maintaining mechanical properties while achieving high thermal conductivity.
Implementation Method 1
Each of the two bonding layers may comprise a base layer and nanoparticles embedded in the base layer. The base layers may comprise materials with high thermal conductivities, such as a metal oxide layer. The nanoparticles may comprise materials with even higher thermal conductivities than the base layers... the two bonding layers may have high thermal conductivities, which lead to effective heat dissipation
Data Source
AI summary
An integrated circuit die with two material layers having metal nano-particles and the method of forming the same are provided. The integrated circuit die includes a device layer comprising a first transistor, a first interconnect structure on a first side of the device layer, a first material layer on the first interconnect structure, wherein the first material layer comprises first metal nano-particles, and a second material layer bonded to the first material layer, wherein the second material layer comprises second metal nano-particles, and wherein the first material layer and the second material layer share an interface.