Nanoparticle Assembly via Co-Solvent Emulsion Dissolution

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Solution Overview

Problem

Existing methods for assembling nanoparticles fail to produce tightly packed, uniform, and organic ligand-free microassemblies, which are essential for optical, magnetic, and electronic device applications, as they often result in non-uniform arrays with organic ligands that lack thermal and optical stability.

Innovation Solution

A method involving the creation of an emulsion with distinct solvents for droplet formation and dissolution, using a first fluid with particles, a second fluid that is not fully miscible, and a third fluid as a co-solvent, allowing for the formation of tightly packed particle assemblies without organic ligands, with controlled size and shape.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If nanoparticles are assembled using existing approaches (crystallization, colloidal crystals, electrophoresis), then particle arrays can be formed, but the arrays are surrounded by organic ligands that interfere with chemical processing and limit durability

Engineering Contradiction:
ImprovedurabilityVSAvoidorganic ligand interference
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent removes organic ligands from the nanoparticle assembly process by using a solvent-free approach where particles are assembled directly from suspension through controlled evaporation and capillary forces, eliminating the harmful organic ligand layer that normally surrounds crystallized nanoparticles

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces an aqueous suspension medium as an intermediary that allows particles to self-assemble without organic ligands, using water-soluble polymers or surfactants as temporary mediators that are removed during drying to leave clean particle-particle contacts

Inventive Principle:
Principle #24Intermediary (Mediator)

2Quantity of substance

If nanoparticles are assembled into tightly packed arrays, then density and material efficacy are improved, but uniformity in array size and shape deteriorates

Engineering Contradiction:
Improvematerial densityVSAvoidarray uniformity
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent performs preliminary size selection and monodispersity control of nanoparticles before assembly, ensuring all particles are within a narrow size distribution range, which enables both tight packing and uniform final array dimensions

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent controls assembly parameters such as suspension concentration, evaporation rate, and substrate temperature to achieve optimal balance between packing density and uniformity, using controlled drying conditions to ensure consistent array formation

Inventive Principle:
Principle #35Parameter changes

3Stability of the object's composition

If organic ligands are used to stabilize nanoparticles during assembly, then particle dispersion is improved, but thermal and optical stability deteriorates due to ligand melting and darkening

Engineering Contradiction:
Improveparticle dispersionVSAvoidthermal stability
Core Design Contradiction:
Stability of the object's compositionVSTemperature

Solution Approach 1:

The patent extracts organic ligands from the system entirely, using ligand-free or inorganic-ligand-stabilized nanoparticles that can be assembled through alternative mechanisms such as electrostatic repulsion control, capillary forces during drying, or magnetic field guidance

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the stabilization mechanism from organic ligand adsorption to controlling surface charge (zeta potential) and using inorganic stabilizers that maintain dispersion without the thermal degradation issues of organic molecules

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of monodisperse, tightly packed, and smooth microassemblies of nanoparticles, suitable for advanced optical and electronic components, with improved thermal and optical stability, and the ability to form complex morphologies.

Implementation Method 1

dissolving the solvent from the droplets into a mixture of the second fluid and the third fluid, thereby forming particle assemblies

Methodology Applied
Scientific EffectDissolution: Solvation

Implementation Method 2

combining the first fluid and the second fluid to generate an emulsion containing a dispersed phase of droplets of the first fluid in the second fluid

Methodology Applied
Scientific EffectEmulsion formation: Emulsion

Data Source

PatentUS11173464B2Methods for dissolving droplet particle assembly with co-solvent, and particle assemblies obtained therefrom
Publication Date: 2021.11.16 HRL LAB
  • US11173464B2 patent drawing
  • US11173464B2 patent drawing
  • US11173464B2 patent drawing

AI summary

Some variations provide a method of assembling a plurality of particles into particle assemblies, comprising: (a) obtaining a first fluid containing particles and a solvent for the particles; (b) obtaining a second fluid not fully miscible with the first fluid; (c) obtaining a third fluid that is a co-solvent for the first fluid and the second fluid; (d) combining the first fluid and the second fluid to generate an emulsion containing droplets of the first fluid in the second fluid; (e) adding the third fluid to the emulsion; and (f) dissolving out the solvent from the droplets into the third fluid, thereby forming particle assemblies. Some variations also provide an assembly of nanoparticles, wherein the assembly has a volume from 1 μm3 to 1 mm3, a packing fraction from 20% to 100%, and/or an average relative surface roughness less than 1%, wherein the assembly is not disposed on a substrate.