Nano-Particle Cooling Manifold Seals for Precise Electronics Bonding
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Solution Overview
Problem
Existing methods for joining substrates in photonic component assemblies face challenges such as misalignment, thermal expansion, and ineffective cooling due to adhesive shrinkage, thermal gradients, and traditional cooling methods that interfere with component functionality.
Innovation Solution
The use of nano-particles, partially sintered to create mechanical bonds, allows for precise alignment and attachment of photonic components with minimal shift, and integrates cooling manifolds that utilize nano-particles to form fluid-impermeable seals for effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If organic adhesives are used for joining substrates, then bonding is achieved, but curing shrinkage produces shifts that introduce coupling losses between components
Solution Approach 1:
The patent changes the material parameter from organic adhesive to inorganic adhesive (e.g., glass frit, borosilicate glass), which fundamentally alters the bonding mechanism. Inorganic adhesives undergo minimal shrinkage during curing compared to organic adhesives, thereby maintaining alignment precision while achieving strong bonding between photonic components
Solution Approach 2:
The patent employs composite material systems combining inorganic adhesive particles with organic binder materials. This composite approach allows the inorganic component to provide minimal shrinkage and high thermal stability, while the organic binder facilitates processing and application, achieving both bonding strength and alignment precision
2Strength
If solder reflow is used to join components, then bonding is achieved, but organic adhesives are heated above glass transition temperature resulting in component misalignment
Solution Approach 1:
The patent changes the bonding mechanism from thermal reflow (which heats components above glass transition temperature) to low-temperature inorganic adhesive bonding. Inorganic adhesives can achieve full cure at temperatures below 200°C, preventing organic adhesive softening and maintaining component alignment stability while still achieving strong bonding
3Strength
If laser welding is used to join components, then bonding is achieved, but large thermal gradients in glass and silicon substrates produce cracks compromising reliability
Solution Approach 1:
The patent changes the bonding process from high-energy laser welding to low-temperature inorganic adhesive bonding. This temperature reduction eliminates large thermal gradients that cause stress and cracking in glass and silicon substrates, maintaining substrate integrity and long-term reliability while achieving sufficient bonding strength through the inorganic adhesive material
4Temperature
If traditional cooling methods are integrated into electronics devices, then cooling is provided, but precise alignment is interfered with and component functionality is compromised
Solution Approach 1:
The patent introduces an intermediary layer of inorganic adhesive material between photonic components and cooling structures. This intermediary layer provides a stable, thermally conductive interface that maintains precise component alignment while enabling effective heat transfer to cooling manifolds, resolving the conflict between cooling efficiency and alignment precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise alignment and attachment of photonic components with minimal distortion, while providing efficient cooling through nano-particle-based cooling manifolds that maintain component functionality and scalability.
Implementation Method 1
nano-particles, such as metal nano-particles partially or fully sintered to create a mechanical bond
Implementation Method 2
integrates cooling manifolds that utilize nano-particles to form fluid-impermeable seals for effective heat dissipation
Data Source
AI summary
Devices and methods for providing cooling to electronics equipment is provided herein. A cooling manifold includes a first substrate having a first hole. A layer of nano-particles is disposed between the first substrate and an electronics surface associated with the electronics equipment. The layer of nano-particles defines a seal between the first substrate and the electronics surface, and further defines a channel extending within the seal. After an application of heat, the layer of nano-particles forms the seal such that the device is fluid impermeable, so as to allow a coolant fluid to enter through the first hole to flow through the channel to reduce or remove the heat generated by the electronics equipment associated with the electronics surface.