Nanoparticle Shield FET for Deformation Sensing

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Solution Overview

Problem

Conventional deformation sensors using strain gauges are bulky, complex, and expensive, limiting spatial resolution and device miniaturization in portable electronic devices.

Innovation Solution

A field effect transistor (FET) apparatus with a shield layer of electrically conducting nanoparticles that changes inter-particle distance and orientation under stress, modulating the electric field and conductance to detect physical deformation, utilizing flexible and optically transparent materials for miniaturization and integration in portable devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If strain gauges are used to detect deformation, then measurement capability is provided, but device size and complexity increase

Engineering Contradiction:
Improvedeformation detection capabilityVSAvoidsystem bulkiness and complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical strain gauge system with an electric field-based FET sensor system. The deformation detection is achieved through electrical measurements of the FET channel conductance, which changes in response to mechanical stress applied to the nanoparticle layer, substituting mechanical measurement with electrical measurement.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes changes in the physical parameters of the nanoparticle layer (inter-particle distance, orientation, spacing) in response to applied stress. These parameter changes modulate the electric field and consequently the FET channel conductance, enabling deformation detection through electrical parameter changes rather than mechanical gauge readings.

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If strain gauges are used to detect deformation, then measurement capability is provided, but manufacturing cost increases

Engineering Contradiction:
Improvedeformation detection capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent replaces expensive mechanical strain gauge systems with a semiconductor-based FET device that can be manufactured using standard semiconductor fabrication techniques, significantly reducing manufacturing cost while maintaining deformation detection capability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs a composite structure combining nanoparticles (metallic or semiconducting) with a polymer matrix to form the third layer. This composite material approach enables the desired mechanical responsiveness while being compatible with cost-effective manufacturing processes.

Inventive Principle:
Principle #40Composite materials

3Measurement precision

If spatial resolution is increased, then deformation detection precision is improved, but device size increases

Engineering Contradiction:
Improvespatial resolutionVSAvoiddevice size
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The patent can implement segmentation by using arrays of individual FET sensors, where each FET corresponds to a specific spatial location. The nanoparticle layer can be patterned or selectively positioned to provide spatially resolved deformation detection, with each FET sensing deformation in its local region.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent achieves high spatial resolution through the nanoscale dimensions of the third layer and nanoparticle spacing. The inter-particle distance and orientation changes occur at the nanometer scale, enabling detection of deformation at very fine spatial scales without requiring large device dimensions.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables sensitive detection of physical deformation with high spatial resolution, comparable to existing deformation sensors, while allowing for miniaturization and integration in portable electronic devices without adverse optical impact.

Implementation Method 1

The stress applied to the third layer may cause one or more of the following: a change in the position of the nanoparticles, a change in the shape of the nanoparticles, a change in the orientation of the nanoparticles, and a change in the distance between adjacent nanoparticles. The change in position, shape, orientation and/or spacing of the nanoparticles may cause the change in effective field strength and therefore the change in electrical conductance.

Methodology Applied
Scientific EffectPiezoresistive effect: Piezoresistive Effect

Implementation Method 2

The electric field may be provided by at least the second layer. The electric field may be formed when a potential difference is applied between the first and second layers.

Methodology Applied
Scientific EffectElectric field: Electric Field

Data Source

PatentEP2742532B1An apparatus
Publication Date: 2021.04.14 PROVENANCE ASSET GROUP LLC
  • EP2742532B1 patent drawingFigure 1~2
  • EP2742532B1 patent drawingFigure 3~4b
  • EP2742532B1 patent drawingFigure 5~6a

AI summary

An apparatus comprising: a first layer (201) configured to enable a flow of charge carriers from a source electrode (203) to a drain electrode (204), a second layer (206) configured to control the density of charge carriers in the first layer (201) using an electric field formed between the first (201) and second (206) layers, and a third layer (211) positioned between the first (201) and second (206) layers to shield the first layer (201) from the electric field, wherein the third layer (211) comprises a layer of electrically conducting nanopartides (212) and is configured such that when stress is applied to the third layer (211), the strength of the electric field experienced by the first layer (201) is varied resulting in a change in the charge carrier density and a corresponding change in the conductance of the first layer (201).