Nanoparticle Film Patterning via Selective Ligand Coordination

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Solution Overview

Problem

Existing nanoparticle film patterning methods, such as the edging and lift-off methods, result in the deterioration of nanoparticles and render them unusable, leading to waste and inefficiency.

Innovation Solution

A nanoparticle film patterning method is developed that includes forming a non-dispersive ligand-containing portion with a nanoparticle and a monodentate non-dispersive ligand, which renders the nanoparticle non-dispersible in a solvent, and then removing the remaining nanoparticle film with a first organic solvent.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If the lift-off method is used to remove nanoparticle film, then the nanoparticle can be removed from the substrate, but the nanoparticle deteriorates due to mixing with resist material and solvent, making it unusable for reuse

Engineering Contradiction:

Improvenanoparticle reusabilityVSAvoidnanoparticle performance

Core Design Contradiction:

Loss of substanceVSReliability

Solution Approach 1:

The invention segments the nanoparticle film into patterned regions by selective removal. The nanoparticle film is divided into remaining portions (forming the pattern) and removed portions, enabling precise spatial control over nanoparticle placement while maintaining nanoparticle integrity through non-contact removal methods

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention introduces an intermediary mechanism (selective adhesion or selective removal) that mediates between the nanoparticle film and the substrate. This intermediary approach allows removal of specific regions without direct contact with harsh solvents or resist materials that would deteriorate the nanoparticles, thereby enabling reuse

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If the edging method is used to pattern nanoparticle film, then the nanoparticle layer pattern can be formed, but the nanoparticle deteriorates due to edging action

Engineering Contradiction:

Improvenanoparticle layer pattern precisionVSAvoidnanoparticle performance

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The invention replaces the mechanical edging action with a non-mechanical patterning approach. Instead of physically cutting or etching the nanoparticle film with edging agents, the method uses selective removal techniques that do not involve mechanical stress or chemical etching, thereby preserving nanoparticle integrity while achieving precise pattern formation

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention introduces an intermediary mechanism that enables pattern formation without direct mechanical or chemical interaction with the nanoparticle surfaces. This intermediary approach allows precise pattern definition while avoiding the deteriorating effects of edging agents on nanoparticle performance

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of operation

If resist solvent is used to remove resist pattern in lift-off method, then the resist pattern can be removed, but the nanoparticle film on resist pattern is also removed and mixed with solvent, making nanoparticle recovery difficult

Engineering Contradiction:

Improveresist pattern removalVSAvoidnanoparticle recovery

Core Design Contradiction:

Ease of operationVSLoss of substance

Solution Approach 1:

The invention extracts the nanoparticle film from the resist pattern before the resist is removed. By selectively removing the nanoparticle film from the resist pattern using selective adhesion or selective removal techniques, the nanoparticle is separated from the resist material, preventing mixing and enabling recovery while the resist is subsequently removed with solvent

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention performs preliminary removal of the nanoparticle film from the resist pattern before the resist itself is removed. This preliminary action separates the nanoparticle from the resist material that will later be dissolved by solvent, preventing contamination and enabling nanoparticle recovery and reuse

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for the recovery and reuse of removed nanoparticles with minimal deterioration, while also forming a nanoparticle layer pattern with reduced deterioration, thus enhancing the efficiency of the nanoparticle film patterning process.

Implementation Method 1

a monodentate non-dispersive ligand that is coordinated to the nanoparticle to render the nanoparticle non-dispersible in a solvent

Methodology Applied

Scientific EffectLigand coordination: Chemical Bonding

Implementation Method 2

removing a portion of the nanoparticle film other than the non-dispersive ligand-containing portion with a first organic solvent

Methodology Applied

Scientific EffectSolvent dissolution: Solvation

Data Source

PatentUS20250060518A1Nanoparticle film patterning method, method for producing light-emitting element, method for producing display device, and light-emitting element

Publication Date: 2025.02.20 SHARP KK

AI summary

A non-dispersive ligand-containing portion containing a monodentate ligand that is coordinated to a QD to render the QD non-dispersible in a solvent is formed in a part of a QD film containing the QD, and a portion of the QD film other than the non-dispersive ligand-containing portion is removed by a solvent to form a QD layer pattern.