Nanoparticle Ink Coating via Atomic Layer Deposition for Oxidation Resistance
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Solution Overview
Problem
Electronic circuits and devices with exposed metal components formed using nanoparticle inks are susceptible to oxidation and corrosion, which deteriorates their electrical performance and longevity, especially when exposed to corrosive environments.
Innovation Solution
A method involving the deposition of nanoparticle ink on a substrate, followed by curing and subsequent exposure to precursor gases to form a protective oxide layer, which can be repeated to achieve a desired thickness and prevent pinholes, using atomic layer deposition (ALD) to create a conformal coating of aluminum oxide, titanium oxide, or hafnium oxide.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If nanoparticle ink is used to form conductive material, then manufacturing precision and electrical performance are improved, but susceptibility to oxidation and corrosion increases
Solution Approach 1:
The patent applies composite materials by combining nanoparticle ink with conformal oxide coatings (aluminum oxide, titanium oxide, or hafnium oxide). The oxide layer forms a protective composite structure over the nanoparticle conductive material, preventing direct exposure to corrosive environments while maintaining the electrical properties of the underlying nanoparticle structure.
Solution Approach 2:
The patent creates an inert protective environment by forming conformal oxide coatings that act as barrier layers. These oxide layers provide an inert interface between the reactive nanoparticle metal and the external environment, preventing oxidation and corrosion by isolating the conductive material from oxygen and moisture.
2Reliability
If conformal coating is applied to protect nanoparticle ink, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent replaces mechanical or manual coating methods with atomic layer deposition (ALD), a vapor-phase deposition technique. This substitution enables precise, uniform conformal coating at the nanoscale level that automatically follows the substrate topology, eliminating the need for complex mechanical coating equipment and manual intervention.
Solution Approach 2:
The patent utilizes parameter changes in the ALD process, specifically controlling deposition temperature, precursor gas flow rates, and cycle numbers to achieve the desired oxide layer thickness and properties. By optimizing these parameters, the process achieves reliable protection with a standardized, controllable methodology.
3Manufacturing precision
If oxide layer thickness is increased to prevent pinholes, then protection quality is improved, but manufacturing time increases
Solution Approach 1:
The patent replaces slow, sequential manual coating procedures with atomic layer deposition, which deposits material in precisely controlled atomic layers. This enables the formation of pinhole-free conformal coatings at controlled thicknesses without requiring excessive deposition time, as each ALD cycle deposits a known quantity of material uniformly across the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides precise and complete protection of small structures formed with nanoparticle ink, maintaining electrical performance and longevity even under adverse conditions by preventing corrosion and oxidation.
Implementation Method 1
subjecting the cured nanoparticle ink to a first precursor gas to form a first layer of precursor material on the cured nanoparticle ink; and subjecting the first layer of precursor material to a second precursor gas so that the first layer of precursor material reacts with the second precursor gas to form an oxide layer
Implementation Method 2
The exposed metal often has a relatively large surface area that is susceptible to oxidation and corrosion, which is detrimental to electrical performance and longevity
Data Source
AI summary
A method of forming an electronic circuit component comprises (a) depositing nanoparticle ink comprising conductive material on a substrate; (b) curing the nanoparticle ink to form cured nanoparticle ink; (c) subjecting the cured nanoparticle ink to a first precursor gas to form a first layer of precursor material on the cured nanoparticle ink; and (d) subjecting the first layer of precursor material to a second precursor gas so that the first layer of precursor material reacts with the second precursor gas to form an oxide layer on the cured nanoparticle ink.