Nanoparticle Paste Cable for Low Resistance Connections
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Solution Overview
Problem
High power electronics systems face reliability issues due to high electrical resistance at cable connection points, leading to overheating and frequent failures, especially in systems requiring large current and power loads.
Innovation Solution
A cable with a void space filled with an adhesive paste containing metallic nanoparticles, which is applied between the cable strands and compressed during crimping to create a low resistance electrical connection, reducing void space and enhancing metallurgical bonding between strands and the connector.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cable connections are used without nanoparticle paste, then the cable structure is simple and assembly is fast, but electrical resistance is high leading to overheating and reliability issues
Solution Approach 1:
The patent introduces an adhesive paste containing metallic nanoparticles as an intermediary substance between the cable strands and connector. This nanoparticle paste fills void spaces and creates metallurgical bonds, acting as a mediator that improves electrical conductivity and connection reliability without requiring complex alternative connection methods
Solution Approach 2:
The patent changes the physical and chemical parameters of the connection interface by introducing nanoparticles with specific size distributions (1-20 nm), surface area characteristics, and material compositions. These parameter changes enable the paste to flow into void spaces and form low-resistance electrical paths when activated by heat and pressure
2Reliability
If high temperatures are used for brazing or welding to reduce electrical resistance, then electrical resistance is reduced, but assembly time increases and high temperatures are required
Solution Approach 1:
The patent utilizes the unique parameter characteristics of nanoparticles—specifically their small size (1-20 nm), high surface area to volume ratio, and reduced melting points compared to bulk materials. These parameter changes allow the nanoparticle paste to achieve metallurgical bonding and low-resistance electrical connections at lower temperatures and shorter times than traditional brazing or welding processes
Solution Approach 2:
The patent exploits phase transitions of the metallic nanoparticles during the crimping process. The nanoparticles undergo melting and solidification phase changes at reduced temperatures due to their nanoscale dimensions, enabling rapid metallurgical bonding between cable strands and connector without requiring the high temperatures and extended times of conventional thermal joining processes
3Reliability
If void spaces between cable strands are left empty, then the cable structure is simple, but electrical resistance is high due to poor contact between strands and connector
Solution Approach 1:
The adhesive nanoparticle paste serves as an intermediary material that fills the void spaces between cable strands and within the connector interface. This paste displaces air and non-conductive materials from void spaces, creating continuous conductive paths that improve electrical contact quality without fundamentally altering the basic cable structure
Solution Approach 2:
The patent utilizes the porous or void structure between cable strands as a beneficial feature rather than a defect. The adhesive nanoparticle paste is designed to flow into and fill these void spaces, transforming the porous structure into a conductive network that enhances electrical connectivity while maintaining the cable's original geometric configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces electrical resistance and the probability of failure at crimped connection points, creating a strong and reliable electrical contact while minimizing assembly time and avoiding high temperatures typically required for brazing or welding.
Implementation Method 1
enhancing metallurgical bonding between strands and the connector
Implementation Method 2
compressed during crimping to create a low resistance electrical connection
Implementation Method 3
reducing void space and enhancing metallurgical bonding
Data Source
AI summary
A cable can be used to facilitate electrical connections between electrical components. The cable can include a plurality of cable strands forming a void space. An adhesive paste can be applied within the void space. The adhesive paste can include a plurality of metallic nanoparticles. The metallic nanoparticles can fuse with each other and with the plurality of cable strands when energy is applied the connector and the cable. The metallic nanoparticles can include a surfactant, which can be displaced as pressure is applied. Heat can be applied to the adhesive paste to fuse the metallic nanoparticles.