Nanoparticle-Polymer Nanocomposites for Electrical Insulation

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Solution Overview

Problem

Traditional motor insulation systems using mica tape impregnated with epoxy or polyester resins suffer from electrical discharges due to voids generated by delamination, vibrations, and thermal cycling, and the addition of micron-sized fillers either increases stiffness but decreases ductility and opacity, or enhances toughness but reduces stiffness.

Innovation Solution

A modified nanoparticle-filled polymer nanocomposite with a diblock copolymer attached to the nanoparticles, where the inner polymer has a glass transition temperature below room temperature and the outer polymer is compatible with the matrix, providing improved fracture toughness and fatigue properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stress or pressure

If rigid particle fillers are added to epoxy resin, then the stiffness of epoxy is improved, but the ductility and opacity decrease

Engineering Contradiction:
ImprovestiffnessVSAvoidductility
Core Design Contradiction:
Stress or pressureVSStability of the object's composition

Solution Approach 1:

The patent changes the size parameter of fillers from micron-scale to nanoscale (1-100 nanometers), which fundamentally alters the relationship between filler addition and matrix properties. This parameter change allows achieving stiffness improvement without the severe ductility loss associated with micron-sized rigid fillers

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite material system combining nanoscale rigid fillers with epoxy resin matrix. The nanoscale dimension of fillers enables the composite to simultaneously achieve enhanced stiffness and maintained ductility, resolving the contradiction present in traditional micron-filled systems

Inventive Principle:
Principle #40Composite materials

2Strength

If soft particle fillers such as rubber are added to epoxy, then the mechanical toughness is improved, but the stiffness decreases

Engineering Contradiction:
Improvemechanical toughnessVSAvoidstiffness
Core Design Contradiction:
StrengthVSStress or pressure

Solution Approach 1:

The patent changes the size parameter from micron-scale soft fillers to nanoscale fillers, and uses the inner polymer block with low glass transition temperature to provide toughness. This parameter change allows achieving mechanical toughness improvement without the stiffness reduction caused by traditional soft particle fillers

Inventive Principle:
Principle #35Parameter changes

3Ease of operation

If micron-sized fillers are used in impregnation of porous structures, then the penetration is achieved, but sedimentation and wear on porous structure occur

Engineering Contradiction:
ImprovepenetrationVSAvoidmechanical properties
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent changes the size parameter of fillers from micron-scale to nanoscale (1-100 nanometers), which enables much better penetration into porous structures like mica tape. The nanoscale dimension prevents sedimentation and minimizes wear on the porous structure, resolving the reliability issues associated with micron-sized filler impregnation

Inventive Principle:
Principle #35Parameter changes

4Reliability

If traditional mica tape impregnated with epoxy is used, then robust insulation is achieved, but electrical discharges occur due to voids from delamination

Engineering Contradiction:
ImproverobustnessVSAvoidelectrical discharges
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the size parameter of fillers to nanoscale, which can effectively fill and eliminate voids and delamination gaps in the insulation system. This eliminates the harmful electrical discharge paths while maintaining the robustness of the insulation system

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses nanoscale fillers that can effectively fill porous structures and eliminate voids. The nanoscale dimension allows complete penetration and filling of micropores and delamination gaps, preventing electrical discharge while maintaining structural integrity

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modified nanoparticle-filled polymer nanocomposites offer enhanced electrical insulation with improved fracture toughness and fatigue properties, reducing the drawbacks of traditional systems while maintaining mechanical and thermal performance.

Implementation Method 1

a diblock copolymer covalently attached to the nanoparticle

Methodology Applied
Scientific EffectCovalent bonding: Chemical Bonding

Implementation Method 2

an inner polymer exhibiting a glass transition temperature below room temperature

Methodology Applied
Scientific EffectGlass transition:

Data Source

PatentEP2417171B1Diblock copolymer modified nanoparticle-polymer nanocomposites for electrical insulation
Publication Date: 2018.01.24 RENESSELAER POLYTECHNIC INST
  • EP2417171B1 patent drawing
  • EP2417171B1 patent drawing
  • EP2417171B1 patent drawing

AI summary

The invention relates to an electric insulation material including modified nanoparticles, a porous substrate and polymer matrix, wherein the modified nanoparticles include a nanoparticle and a diblock copolymer covalently attached to the nanoparticle, the diblock copolymer including a first block polymer of molecular weight greater than 1000 and a glass transition temperature below room temperature attached to the nanoparticle and a second block polymer of molecular weight greater than 1000 covalently linked to the first block polymer, wherein the second block polymer and the matrix both possess the same chemical functionality. Other electrical insulation materials and methods of making such electrical insulation materials are also disclosed.