Nanoparticle Preform Bonding for Semiconductor Thermal Stress Reduction
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Solution Overview
Problem
The use of solder containing lead in semiconductor chip packaging poses environmental issues and high thermal stress, necessitating a lead-free bonding solution that is cost and time efficient.
Innovation Solution
A bonding structure and method utilizing nanoparticle preparations, where nanoparticles are compacted and applied to substrates using pressure and heat to form a nanoparticle preform, which is then used for lead-free bonding of semiconductor components, reducing thermal stress and environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder containing lead is used to attach semiconductor chip to support substrate, then bonding strength is achieved, but environmental harm increases and thermal stress on semiconductor component increases
Solution Approach 1:
The patent changes the material composition parameter by replacing lead-containing solder with lead-free solder, and modifies the thermal process parameters by using controlled reflow soldering profiles to minimize thermal stress while achieving adequate bonding strength
Solution Approach 2:
The patent employs a disposable solder paste containing flux and solder particles that is applied to the substrate, heated to create a permanent bond, and then discarded along with any defective components, eliminating the need for complex reusable bonding systems
2Object-affected harmful factors
If lead-free bonding method is implemented, then environmental impact is reduced, but bonding process complexity increases
Solution Approach 1:
The patent uses a multi-functional solder paste formulation that combines flux, solder particles, and binding agents in a single material, which performs multiple functions including surface preparation, bonding, and protection, thereby simplifying the overall bonding process despite using lead-free materials
3Strength
If high heat is applied to melt lead-containing solder, then bonding is achieved, but thermal stress on semiconductor component increases
Solution Approach 1:
The patent modifies the thermal processing parameters by using lower peak temperatures and optimized heating rates in the reflow soldering process, combined with lead-free solder alloys that have lower melting points than traditional lead-containing solder, thereby achieving bonding strength while reducing thermal stress on the semiconductor component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables lead-free bonding with reduced thermal budgets, enhancing the efficiency and cost-effectiveness of semiconductor packaging while minimizing environmental concerns.
Implementation Method 1
compacting the nanoparticle preparation by applying a pressure to the nanoparticle preparation
Implementation Method 2
applying pressure and heat to form a nanoparticle preform
Data Source
AI summary
A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a substrate and a workpiece is placed on the nanoparticle preform.