Nanoparticle Thermal Conduit in IC Packages for Heat Extraction

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Solution Overview

Problem

Integrated circuits generate undesired heat, and existing methods for heat management are inadequate, particularly in diverting heat from thermally sensitive components.

Innovation Solution

A thermal conduit with a cohered nanoparticle film is integrated into the package, extending from the exterior to the integrated circuit, utilizing nanoparticles with high thermal conductivity to efficiently transfer heat away from sensitive components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If existing heat management methods are used, then heat removal is attempted, but heat dissipation efficiency is insufficient and thermally sensitive components cannot be adequately protected

Engineering Contradiction:

Improveoperating temperature of integrated circuit componentsVSAvoidthermal management effectiveness

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent extracts heat away from thermally sensitive components by introducing a dedicated thermal conduit that diverts heat flow from the integrated circuit through the encapsulation material to an external heat sink, separating the heat management function from the electronic components

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The thermal conduit acts as an intermediary structure between the integrated circuit and the external environment, facilitating heat transfer through the encapsulation material with optimized thermal pathways that bypass sensitive components

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If conventional encapsulation material is used, then electrical insulation is provided, but thermal conductivity is insufficient for effective heat management

Engineering Contradiction:

Improveelectrical insulation performanceVSAvoidheat dissipation capability

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent employs composite encapsulation material containing thermally conductive filler particles (such as aluminum oxide, aluminum nitride, or boron nitride) dispersed within an electrically insulating polymer matrix, achieving both electrical insulation and enhanced thermal conductivity simultaneously

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermal conduit effectively reduces operating temperatures of integrated circuit components by enhancing heat dissipation through materials like aluminum oxide, diamond, or graphene, improving thermal management and temperature measurement accuracy.

Implementation Method 1

The thermal conduit has a thermal conductivity higher than the encapsulation material contacting the thermal conduit. The thermal conduit includes a cohered nanoparticle film.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12500082B2Semicondctor device package thermal conduit

Publication Date: 2025.12.16 TEXAS INSTRUMENTS INC

AI summary

A packaged electronic device includes an integrated circuit and an electrically non-conductive encapsulation material in contact with the integrated circuit. A thermal conduit extends from an exterior of the package, through the encapsulation material, to the integrated circuit. The thermal conduit has a thermal conductivity higher than the encapsulation material contacting the thermal conduit. The thermal conduit includes a cohered nanoparticle film. The cohered nanoparticle film is formed by a method which includes an additive process.