Nanoparticle Thermal Routing Trench for IC Heat Diversion

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Solution Overview

Problem

Integrated circuits face challenges in effectively managing excess heat, particularly in diverting heat from thermally sensitive components to prevent damage and ensure optimal performance.

Innovation Solution

Incorporating a thermal routing trench with a cohered nanoparticle film in the substrate, which has higher thermal conductivity than the semiconductor material, to divert heat away from sensitive components through a liner and nanoparticle film structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional heat management methods are used in integrated circuits, then the structure remains simple and manufacturing is easy, but heat dissipation efficiency is insufficient and thermally sensitive components are damaged

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal routing structure complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The substrate is divided into multiple regions including thermal routing trenches that segment the heat flow paths. These trenches create dedicated thermal conduction channels separated from the active device regions, allowing independent optimization of heat dissipation without interfering with device functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thermal routing trench is filled with a composite material having higher thermal conductivity than the surrounding semiconductor substrate. This composite filling material creates a preferential heat conduction path that efficiently transports heat away from sensitive components while maintaining structural integrity.

Inventive Principle:

Principle #40Composite materials

2Loss of energy

If thermal routing trench with cohered nanoparticle film is implemented, then heat dissipation efficiency is improved, but manufacturing process complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing process ease

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The mechanical deposition process is replaced with a chemical vapor deposition (CVD) process that directly forms the cohered nanoparticle film within the trench. This substitution eliminates the need for separate nanoparticle placement and consolidation steps, reducing manufacturing complexity while achieving the desired thermal conductivity enhancement.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The CVD process parameters (temperature, pressure, gas composition) are optimized to directly produce cohered nanoparticle structures with high thermal conductivity. By controlling deposition conditions, the process transforms standard CVD into a method that creates the specific nanoparticle film structure needed for efficient heat dissipation.

Inventive Principle:

Principle #35Parameter changes

3Temperature

If higher thermal conductivity material is used in thermal routing trench, then heat diversion from sensitive components is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal conductivityVSAvoidtrench formation precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The trench is formed with predetermined dimensions and geometry before the thermal conduction material is deposited. This preliminary structuring establishes the thermal routing path in advance, allowing subsequent material deposition to simply fill and conform to the pre-defined geometry, thereby reducing the precision requirements for the high-thermal-conductivity material placement.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat management by providing a more efficient pathway for heat dissipation, reducing the risk of damage to thermally sensitive components and improving overall performance by maintaining a closely matched thermal environment for heat-generating components.

Implementation Method 1

The thermal routing trench has a thermal conductivity higher than the semiconductor material touching the thermal routing trench

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11996343B2Thermal routing trench by additive processing

Publication Date: 2024.05.28 TEXAS INSTRUMENTS INC

AI summary

An integrated circuit has a substrate that includes a semiconductor material, and an interconnect region disposed on the substrate. The integrated circuit includes a thermal routing trench in the substrate. The thermal routing trench includes a cohered nanoparticle film in which adjacent nanoparticles are cohered to each other. The thermal routing trench has a thermal conductivity higher than the semiconductor material contacting the thermal routing trench. The cohered nanoparticle film is formed by an additive process.