Nanopattern Metal Layer for LED Package Oxidation Resistance

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Solution Overview

Problem

Silver-plated layers in LED packages are prone to oxidation due to external moisture, leading to reduced reflectivity and brightness, as well as discoloration, when exposed to external impurities.

Innovation Solution

A light emitting device package with a nanopattern metal layer on the reflective layer, which is smaller than the wavelength of light emitted, enhances adhesion to the molding part, prevents oxidation, and improves light extraction efficiency by utilizing silver nanoparticles or other metals like Ag, forming a uniform and wide surface area to block impurities and enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a silver-plated layer is disposed on the lead frame to reflect light, then brightness of light emitted from the LED package is improved, but the silver-plated layer is easily oxidized by external moisture or air, leading to degraded reflectivity and discoloration

Engineering Contradiction:
ImprovebrightnessVSAvoidoxidation resistance
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The patent introduces a barrier layer as an intermediary between the silver-plated reflective layer and the external environment. This barrier layer prevents direct contact between moisture/air and the silver layer, thereby preventing oxidation while maintaining the reflective properties and brightness enhancement

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If the silver-plated layer is exposed to external moisture, then moisture can penetrate into the molding part or space between molding part and housing, but this leads to oxidation of the silver-plated layer and degradation of reflectivity

Engineering Contradiction:
Improvemoisture penetrationVSAvoidoxidation damage
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent converts the harmful effect of moisture penetration into a beneficial outcome by using the barrier layer to block moisture from reaching the silver layer. The barrier layer transforms the potential harm of moisture exposure into a protective function, preventing oxidation while allowing the package to maintain its structural integrity and optical performance

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The nanopattern metal layer effectively prevents discoloration and improves light extraction efficiency by maintaining reflectivity and heat dissipation, ensuring consistent brightness and color stability of the LED package.

Implementation Method 1

A silver-plated layer may be disposed on a surface of the lead frame to reflect light emitted from the light emitting chip

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

such a silver-plated layer of a lead frame is easily oxidized by external moisture or air

Methodology Applied
Scientific EffectOxidation prevention: Oxidation

Data Source

PatentUS8912560B2Light emitting device package
Publication Date: 2014.12.16 SUZHOU LEKIN SEMICON CO LTD
  • US8912560B2 patent drawing
  • US8912560B2 patent drawing
  • US8912560B2 patent drawing

AI summary

Provided are a light emitting device package, a method of manufacturing the light emitting device package, and a lighting system. The light emitting device package includes a package body, an electrode layer, a reflective layer, a nanopattern metal layer, a light emitting device, and a molding part. The electrode layer is disposed on the package body. The reflective layer is disposed over the electrode layer. The nanopattern metal layer is disposed over the reflective layer. The light emitting device is displayed over the electrode layer. The molding part is disposed over the light emitting device.