Nanoplasmonic Cooling via Evanescent Coupling
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Solution Overview
Problem
Nanoplasmonic devices face challenges in achieving efficient and compact cooling due to localized heating from sub-wavelength optical energy coupling, as conventional methods like bulk metallic layers can spread heat and alter near-field characteristics.
Innovation Solution
A nanoplasmonic device with a heatable layer having a heating side and a cooling side, featuring a nanoscale cooling structure that includes embedded nanoparticles supporting surface plasmon or phonon resonances, and a substrate with sub-micron channels for localized cooling, enhancing radiative heat transfer through evanescent coupling and phonon tunneling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a bulk metallic layer is used for cooling, then heat can be removed from the device, but the heat is spread out causing general heating and near-field characteristics are altered
Solution Approach 1:
The patent replaces bulk metallic cooling layers with nanoscale cooling structures that are spatially localized at specific cooling sites on the heatable layer. These nanoscale structures provide localized heat removal without affecting other regions, thereby maintaining the near-field optical characteristics while achieving effective cooling where needed.
Solution Approach 2:
The cooling function is segmented from the bulk metallic layer into discrete nanoscale cooling structures positioned at specific locations. This segmentation allows independent control of cooling at different sites and prevents the heat spreading effect that occurs with continuous bulk metallic layers.
2Temperature
If conventional cooling methods are used, then heat can be removed, but the cooling is not efficient and compact
Solution Approach 1:
The patent transitions from two-dimensional bulk metallic cooling layers to three-dimensional nanoscale cooling structures with vertical positioning capability. This dimensional change enables compact integration of cooling functions within the device stack, improving cooling efficiency while maintaining a compact overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and localized cooling of nanoplasmonic devices by enhancing radiative heat transfer, maintaining near-field characteristics and achieving rapid cooling where needed, thereby addressing the inefficiencies of traditional cooling methods.
Implementation Method 1
enhancing radiative heat transfer through evanescent coupling and phonon tunneling
Implementation Method 2
enhancing radiative heat transfer through evanescent coupling and phonon tunneling
Implementation Method 3
enhancing radiative heat transfer through evanescent coupling and phonon tunneling
Implementation Method 4
a nanoscale cooling structure that includes embedded nanoparticles supporting surface plasmon or phonon resonances
Implementation Method 5
a nanoscale cooling structure that includes embedded nanoparticles supporting surface plasmon or phonon resonances
Data Source
Figure 1~2
Figure 3~4
AI summary
A nanoplasmonic device includes a nanoplasmonicly heatable layer having a heating side and a cooling side, the heatable layer including a plurality of localized energy receiving sites; and a cooling structure located adjacent to the cooling side, the cooling structure including a nanoscale structure to remove heat from the heated layer.