Nanoscale Fault Isolation via Multi-Probe Near-Field Scanning
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Solution Overview
Problem
Current nanoscale fault isolation and measurement tools lack the sensitivity and spatial resolution needed for devices smaller than 100 nanometers, and they are limited in their ability to perform multiple measurements on a common platform, especially when external electrical energy is required, and they struggle with aligning data from different sensors.
Innovation Solution
A nanoscale fault isolation and measurement system that uses a holder to supply electrical bias and a multi-probe assembly with multiple implements for near-field scanning, allowing for simultaneous electrical and physical measurements on a common platform, with probes that can be precisely aligned and correlated with design data to identify faults.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional physical fault isolation tools are used, then measurements can be taken on larger devices, but sensitivity and spatial resolution become insufficient for nanoscale devices smaller than 100 nanometers
Solution Approach 1:
The patent combines multiple scanning probes (electrical, optical, magnetic, thermal) into a single integrated probe that can perform multiple measurements simultaneously. This merging of functions allows the system to achieve nanoscale spatial resolution while maintaining versatility across different measurement modalities, directly resolving the contradiction between measurement precision and adaptability to nanoscale devices.
Solution Approach 2:
The integrated scanning probe is designed to perform multiple functions including electrical measurements, optical detection, magnetic field sensing, and thermal characterization. This multi-functionality enables the single probe to adapt to various nanoscale device types and measurement requirements while maintaining high spatial resolution, thus resolving the contradiction between precision and versatility.
2Measurement precision
If scanning probe systems are used with external electrical energy or bias, then electrical measurements can be made, but the system is limited to objects with large enough connection points for soldering or wire-bonding
Solution Approach 1:
The patent replaces traditional mechanical connection methods (soldering, wire-bonding) with a non-contact or minimal-contact scanning probe approach. The probe can establish electrical connections through near-field interactions or atomic force microscopy techniques, eliminating the need for large connection points and enabling measurements on nanoscale devices where such connections are impossible.
3Measurement precision
If separate instruments with single probes are used, then each measurement can be taken with specialized equipment, but data from different probes cannot be spatially registered and aligned
Solution Approach 1:
The patent merges multiple specialized measurement capabilities into a single integrated probe, ensuring that all measurements are taken from the exact same spatial location simultaneously. This eliminates the spatial alignment problem inherent in using separate instruments, as the co-located sensors inherently provide spatially registered data across all measurement modalities.
4Adaptability or versatility
If multiple probes are used on separate instruments, then various electrical and physical measurements can be made, but the system complexity increases and spatial resolution decreases
Solution Approach 1:
The patent combines multiple measurement functions into a single integrated probe structure, reducing system complexity while maintaining measurement variety. The unified probe design eliminates the need for multiple separate instruments and their associated alignment mechanisms, thereby reducing overall system complexity while preserving the ability to perform diverse electrical and physical measurements.
Data Source
AI summary
Disclosed is a fault isolation and measurement system that provides multiple near-field scanning isolation techniques on a common platform. The system incorporates the use of a specialized holder to supply electrical bias to internal circuit structures located within an area of a device or material. The system further uses a multi-probe assembly. Each probe is mounted to a support structure around a common reference point and is a component of a different measurement or fault isolation tool. The assembly moves such that each probe can obtain measurements from the same fixed location on the device or material. The relative positioning of the support structure and/or the holder can be changed in order to obtain measurements from multiple same fixed locations within the area. Additionally, the system uses a processor for providing layered images associated with each signal and for precisely aligning those images with design data in order to characterize, or isolate fault locations within the device or material.