Nanoscale Conductor Interconnects for Fine-Pitch Stacked Die Alignment
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Solution Overview
Problem
Implementing stacked die arrangements poses challenges such as consistent die placement accuracy and fine pitch interconnection terminal alignment, which complicates electrical connections between microelectronic elements.
Innovation Solution
A microelectronic assembly featuring an insulating layer with a nanoscale conductor array that forms electrical interconnections between microelectronic elements, allowing for universal interconnection without precise alignment, using diblock copolymer self-assembly to create nanoscale conductors that extend through the layer and connect terminals on both sides of the elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional alignment methods are used for stacked die arrangements, then precise alignment of interconnection terminals can be achieved, but the manufacturing complexity and difficulty of die placement increase significantly
Solution Approach 1:
The nanoscale conductor array performs self-alignment through the self-assembly process of diblock copolymers, eliminating the need for complex external alignment mechanisms. The block copolymer system automatically organizes into periodic nanoscale patterns that define conductor positions, making the alignment process self-directed and significantly reducing manufacturing complexity while maintaining nanoscale precision
Solution Approach 2:
The invention changes the fundamental parameter of alignment from mechanical positioning to chemical self-organization. By utilizing the phase separation and self-assembly properties of diblock copolymers, the system transitions from requiring precise mechanical control to exploiting thermodynamic self-organization, thereby reducing manufacturing complexity while achieving consistent nanoscale alignment
2Speed
If nanoscale conductor arrays are used for interconnection, then signal propagation time is reduced and high-speed operation is facilitated, but the manufacturing process complexity increases
Solution Approach 1:
The invention replaces traditional mechanical lithography and conductor formation processes with a chemical self-assembly approach. Instead of using mechanical tools to pattern conductors at nanoscale dimensions, the system uses diblock copolymer self-organization to automatically create the desired nanoscale conductor array, simplifying the manufacturing process while enabling the short interconnection lengths needed for high-speed operation
3Ease of manufacture
If flexible contact patterns are allowed without precise alignment, then ease of manufacturing improves, but interconnection reliability may deteriorate
Solution Approach 1:
The invention uses the analogy of fluid self-organization to describe how diblock copolymers spontaneously form ordered nanoscale patterns through phase separation. This self-organizing behavior, driven by thermodynamic forces rather than mechanical constraints, creates reliable and repeatable conductor patterns that are insensitive to variations in contact placement, thereby maintaining interconnection reliability while enabling manufacturing flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The nanoscale conductor array enables reliable and efficient electrical interconnections between microelectronic elements, facilitating high-speed operation and reducing signal propagation time by allowing for flexible contact patterns and layouts, thus overcoming alignment challenges in stacked die arrangements.
Implementation Method 1
forming an insulating layer comprising a diblock copolymer on a substrate, the insulating layer including a self-assembled nanoscale matrix array of a first polymer and a second polymer
Implementation Method 2
filling the plurality of nanoscale holes with one or more conductive materials to form a plurality of nanoscale conductors within the insulating layer
Data Source
Figure 1
Figure 2A~2E
Figure 3A~3G
AI summary
A microelectronic assembly including an insulating layer having a plurality of nanoscale conductors disposed in a nanoscale pitch array therein and a pair of microelectronic elements is provided. The nanoscale conductors can form electrical interconnections between contacts of the microelectronic elements while the insulating layer can mechanically couple the microelectronic elements together.