Backside Power Distribution Planes for Dense Nanosheet Devices
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Solution Overview
Problem
As nanosheet technology scales down, the challenge of providing power in a cost-effective manner becomes increasingly difficult due to interference between smaller and closer devices, making it hard to distribute power effectively.
Innovation Solution
A backside power distribution network (BSDPN) is implemented, featuring a power plane that extends across multiple power rails, reducing the need for multiple metal layers and lithography steps, and includes a metal-insulator-metal (MIM) capacitor configuration to enhance power delivery and reduce noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If nanosheet devices are scaled down and placed closer together, then device density increases, but interference between devices increases and power distribution becomes more difficult
Solution Approach 1:
The patent introduces a backside power distribution network on the rear surface of the substrate, moving the power distribution system from the planar (2D) front surface to the third dimension (back surface). This dimensional transition allows power rails and planes to be formed independently from the device region, enabling effective power distribution even as devices are densely packed on the front surface without interference.
2Power
If multiple metal layers and lithography steps are used for power distribution, then power delivery capability improves, but manufacturing complexity and cost increase
Solution Approach 1:
The power distribution network is segmented into distinct functional layers: power rails on the backside substrate surface, intermediate connection structures, and frontside power planes. This segmentation allows each layer to be optimized independently and connected through controlled vias, achieving high power delivery capability while simplifying the overall manufacturing process compared to traditional multi-layer approaches.
Solution Approach 2:
The patent introduces intermediate connection structures (including skip vias and connection vias) that act as mediators between the backside power rails and frontside power planes. These intermediaries enable efficient power transfer across the substrate thickness while allowing independent optimization of each power distribution layer, reducing the need for complex multi-layer metal structures.
3Ease of manufacture
If power is distributed locally, then manufacturing simplicity is maintained, but power delivery efficiency and noise reduction capability are limited
Solution Approach 1:
The patent merges local and global power distribution approaches by forming continuous power planes on the frontside that are fed by backside power rails. This combination allows the system to benefit from both the manufacturing simplicity of planar power planes and the efficient power delivery of globally connected backside rails, achieving low resistance power distribution across the entire device region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs, improves power delivery efficiency, and minimizes wafer warpage by distributing power globally with lower resistance, while also increasing decoupling capacitance and reducing power supply noise.
Implementation Method 1
A metal-insulator-metal (MIM) capacitor is formed from the arrangement of the first power plane, the insulator layer, and the second power plane
Data Source
AI summary
A microelectronic structure including a backside-power-distribution-network (BSDPN) connected to a backside of a device region. The BSPDN includes a plurality of first type power rails and a plurality of second type power rails located on the same level. A first power plane located on a level above the plurality of first type power rails and the plurality of second type power rails. The first power plane extends across the plurality of first type power rails and the plurality of second type power rails and the first power plane is connected to a plurality of first type power rails, but not connected to the plurality of second type power rails.