Nanostamping Method for Nano-Optical Components

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Solution Overview

Problem

The manufacturing of nano-optical components requires precise sub-wavelength structuring, which is challenging due to the need for precise removal of embossing material bases in nanostamping methods, leading to complex and inefficient processes.

Innovation Solution

A nanostamping method that forms a nanostructure in an optical embossing material on a first carrier substrate using a forming stamp, followed by coating with a filler material layer and applying a second carrier substrate, allowing for the removal of the embossing material base through layer ablation, thereby simplifying the process and improving performance characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional nanostamping methods are used to create nanostructures, then sub-wavelength precision can be achieved, but the removal of embossing material base becomes complex and inefficient

Engineering Contradiction:

Improvesub-wavelength precisionVSAvoidprocess complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent divides the embossing material into two functional segments: the nanostructure portion that remains and the embossing material base that is removed. By segmenting the material removal process from the nanostructure formation, the patent simplifies the overall process while maintaining sub-wavelength precision in the remaining nanostructure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent extracts and removes the embossing material base through ablation after the nanostructure has been formed. This extraction step separates the useful nanostructure from the unnecessary embossing material, simplifying the final structure and improving manufacturing efficiency while preserving the precision of the nanostructure.

Inventive Principle:

Principle #2Taking out (Extraction)

2Manufacturing precision

If deep etching is used to remove embossing material base, then complete removal can be achieved, but manufacturing efficiency decreases

Engineering Contradiction:

Improvecomplete material removalVSAvoidmanufacturing efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces deep mechanical etching with ablation technology to remove the embossing material base. Ablation provides a more efficient and precise material removal method that achieves complete removal without requiring as much processing depth, thereby improving manufacturing efficiency while maintaining complete material removal.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If nano-elevations are closely spaced, then higher resolution is achieved, but manufacturing difficulty increases

Engineering Contradiction:

Improvenanostructure resolutionVSAvoidmanufacturing difficulty

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent performs preliminary structuring of the nano-elevations during the embossing process itself, before any material removal or subsequent processing steps. By pre-forming the nanostructures with the required precision and spacing during embossing, the patent eliminates the need for additional precision-critical steps, thereby reducing manufacturing difficulty while achieving high resolution.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the production of nano-optical components with improved performance by separating nano-elevations from each other, reducing the need for deep etching and enhancing optical characteristics through the use of materials with significant refractive index differences.

Implementation Method 1

A molecular rearrangement takes place at the interface between the nano-relief of the forming stamp and the surface of the embossing material

Methodology Applied

Scientific EffectMolecular rearrangement:

Implementation Method 2

a coated nanostructure is generated by covering the nano-elevations with a filler material layer

Methodology Applied

Scientific EffectMaterial deposition: Deposition (physical)

Implementation Method 3

the embossing material base is completely removed

Methodology Applied

Scientific EffectLayer ablation: Ablation

Implementation Method 4

periodically arranged dielectrics with sufficiently large refractive index differences, whose period length corresponds to about half the light wavelength, lead to photonic band gaps

Methodology Applied

Scientific EffectRefraction: Refraction

Data Source

PatentUS12197126B2Nanostamping method and nano-optical component

Publication Date: 2025.01.14 OSRAM OPTO SEMICON GMBH & CO OHG

AI summary

In an embodiment a nanostamping method includes forming a nanostructure in a layer of optical embossing material on a first carrier substrate by a forming stamp having a nano-relief, wherein the nanostructure comprises a plurality of nano-elevations which are connected via an embossing material base, generating a coated nanostructure by covering the nano-elevations with a filler material layer, wherein the filler material layer and the optical embossing material comprise different refractive indices, applying a second carrier substrate on the coated nanostructure, detaching the first carrier substrate and removing a material of the embossing material base.