Printed Nanostructure Arrays for Passive Chip Radiative Cooling

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Solution Overview

Problem

Current thermal management technologies for electronic devices face challenges in efficiently dissipating heat due to increased heat generation from higher transistor density and faster performance, leading to issues like noise, power consumption, and space constraints, while existing nanostructures for thermal emission have limitations in effectiveness and applicability.

Innovation Solution

The implementation of printed micro and nanostructured arrays, including nanoscale emitter grids and radiation absorbing pillars, that emit and absorb thermal radiation in the near-infrared spectrum to enhance cooling efficiency by transferring thermal energy away from electronic components and their packaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cooling fans are used to dissipate heat from electronic components, then heat dissipation is improved, but noise increases, power consumption increases, and device space is reduced

Engineering Contradiction:

Improveheat dissipationVSAvoidnoise and power consumption

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The patent replaces mechanical cooling fans with passive radiative cooling structures consisting of nanoscale emitter grids and radiation absorbing pillars. These structures directly convert thermal energy to electromagnetic radiation in the atmospheric window (8-13 μm), eliminating moving parts and mechanical noise while reducing power consumption to only what is needed for the electronic component operation itself.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the thermal emission parameters by designing nanostructures with specific geometric parameters (pillar diameter, grid spacing, height) that tune the emission spectrum to match the atmospheric transmission window. This selective parameter optimization enables efficient radiative cooling at specific wavelengths without requiring mechanical active cooling systems.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If transistor density and performance are increased, then computational performance is improved, but heat generation increases

Engineering Contradiction:

Improvecomputational performanceVSAvoidheat generation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent converts the harmful waste heat generated by high-density transistors into useful electromagnetic radiation in the atmospheric window. The nanoscale emitter structures are designed to specifically emit thermal radiation at wavelengths (8-13 μm) that can pass through the atmosphere, effectively transforming the problematic heat byproduct into a beneficial radiative cooling mechanism.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Temperature

If conventional thermal emission structures are used, then some heat dissipation is achieved, but cooling efficiency is insufficient for high-performance devices

Engineering Contradiction:

Improveheat dissipationVSAvoidcooling efficiency

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies local quality optimization by designing nanoscale emitter grids and radiation absorbing pillars with specific local geometric properties at the chip surface. These localized structures create regions of enhanced emissivity in the atmospheric window, concentrating cooling effectiveness precisely where high-performance devices generate the most heat, rather than using uniform conventional thermal emission surfaces.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The nanostructured arrays provide passive, modular, and efficient thermal management, enhancing cooling power by up to 50% and effectively addressing thermal stress and hot spots in electronic devices, compatible with both chip-based components and packaging materials.

Implementation Method 1

The cooling element is tuned to emit thermal radiation in a NIR wavelength or wavelength band so as to transfer thermal radiation from a heat-producing electronic component

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

NIR radiation emitted by the cooling element is absorbed at the outer package housing of the chip by photonic absorption of a nanostructure absorber and re-emitted outside the device

Methodology Applied

Scientific EffectPhotonic absorption: Absorption (EM radiation)

Data Source

PatentUS12456659B2Printed micro and nanostructured arrays for thermal management of electronic devices

Publication Date: 2025.10.28 NORTHEASTERN UNIV (US)

AI summary

Systems and methods for cooling integrated circuits and other chop-based electronic devices use plasmonic absorption and emission of near infrared (NIR) radiation. Nanostructure arrays tuned to appropriate infrared wavelengths emit NIR from a hot chip substrate to other nanostructure arrays at the chip outer package, which absorb the NIR and transmit it away from the package outer surface.