Nanostructure Layer Coating for EMI Shielding and Electrical Contact
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Solution Overview
Problem
Existing technologies for forming conductive layers in flat panel electrochromic displays face challenges in achieving efficient electrical communication between nanostructure layers and external components, particularly in providing effective electromagnetic interference (EMI) and electrostatic discharge (ESD) shielding while maintaining transparency and mechanical protection.
Innovation Solution
A layered structure comprising a nanostructure layer with a coating layer that includes a reflowable polymer and conductive plugs extending from the inner to the outer surface, allowing for electrical communication and enhanced adhesion, and optionally incorporating UV curable resins and adhesion promoters to improve mechanical and chemical protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a coating layer is formed over the nanostructure layer to provide mechanical protection and adhesion, then the mechanical strength and adhesion are improved, but electrical communication between the nanostructure layer and external components is blocked
Solution Approach 1:
The coating layer is segmented into multiple functional layers: a lower adhesion promoter layer that maintains electrical continuity with the nanostructure layer, and an upper protective coating layer that provides mechanical protection. This segmentation allows each layer to specialize in its function while working together as an integrated system.
Solution Approach 2:
An adhesion promoter layer acts as an intermediary between the nanostructure layer and the protective coating layer. This intermediate layer facilitates both mechanical adhesion and electrical communication, bridging the gap between the conductive nanostructure layer and the insulating protective coating.
2Reliability
If the coating layer is made thicker to enhance mechanical protection and chemical resistance, then the protection capability is improved, but transparency of the layered structure is reduced
Solution Approach 1:
The refractive index and thickness parameters of the coating layer are optimized to achieve a balance between protection and transparency. By controlling these parameters, the coating provides enhanced mechanical and chemical protection while maintaining optical clarity through refractive index matching with the nanostructure layer.
3Ease of manufacture
If conventional coating materials are used to form the coating layer, then the manufacturing process is simple, but adhesion to the nanostructure layer is insufficient
Solution Approach 1:
The coating layer is formed using composite materials that combine adhesion promoters with protective coating materials. This composite approach enhances adhesion to the nanostructure layer while maintaining the protective functions and can be applied using conventional coating processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective EMI and ESD shielding, maintains transparency, and provides mechanical and chemical protection, ensuring reliable electrical communication and durability of the conductive layers in display applications.
Implementation Method 1
The coating layer includes a reflowable polymer that may include poly(methyl methacrylate) (PMMA)... The conductive plug is configured to be placed in electrical communication with the nanostructure layer
Implementation Method 2
The coating layer may also include a UV curable resin, a blocked isocyanate and/or a melamine based cross-linker and/or other adhesion promoters
Data Source
AI summary
The present disclosure is directed to a method of forming a layered structure including a nanostructure layer having nanostructures. The method includes: forming a coating layer on the surface of the nanostructure layer, reflowing the coating layer, depositing one or more conductive plugs into the coating layer, and hardening the coating layer. The one or more conductive plugs each has a first portion configured to be placed in electrical communication with the nanostructure layer and a second portion not covered by the coating layer.


