Nanostructure Transfer via Solvent-Removable Adhesive and Metal Layer

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Solution Overview

Problem

Existing methods for transferring nanostructures to silicon wafers or flexible substrates face challenges such as incomplete removal of organic sacrificial layers, leading to poor contact with metal electrodes and incompatibility with plastic substrates due to high-temperature requirements.

Innovation Solution

A method involving an adhesive layer and a metal layer is used to transfer nanostructures, where the adhesive layer is coated with an organic solvent to separate it from the nanostructure and target substrate, with the metal layer preventing dissolution and enhancing mechanical strength, allowing for residue-free transfer at room temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If annealing in argon atmosphere is used to remove organic layer, then organic layer removal is achieved, but plastic substrates cannot be processed due to high temperature requirement

Engineering Contradiction:

Improveorganic layer removal completenessVSAvoidsubstrate compatibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent changes the removal mechanism from thermal (annealing) to chemical (solvent-based), allowing the process to be performed at room temperature. This enables processing of temperature-sensitive substrates like plastics while maintaining effective organic layer removal.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal field (annealing) with a chemical field (solvent interaction). The organic layer is removed through chemical dissolution in solvents like acetone or toluene rather than thermal decomposition, enabling low-temperature processing compatible with plastic substrates.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If organic sacrificial layer is used for transfer, then transfer process is enabled, but residues remain on nanostructures and target substrate

Engineering Contradiction:

Improvetransfer process feasibilityVSAvoidsurface cleanliness

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent introduces a specifically designed sacrificial layer that acts as an intermediary with controlled solubility. This layer facilitates the transfer process but can be completely removed using selective solvents, leaving no residues on the nanostructures or target substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The sacrificial layer is designed as a temporary, disposable component that serves its purpose during transfer and is then completely removed. It is not intended to remain in the final structure, and the process ensures its complete elimination without residues.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Reliability

If high temperature annealing is used to remove organic layer, then organic layer is removed, but plastic substrates are damaged

Engineering Contradiction:

Improveorganic layer removal efficiencyVSAvoidsubstrate temperature tolerance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent replaces thermal removal with solvent-based chemical removal. The organic layer dissolves in solvents like acetone or toluene at room temperature, eliminating the need for high-temperature annealing that would damage plastic substrates.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the operating temperature parameter from high (annealing) to low (room temperature solvent processing). This parameter change enables the processing of temperature-sensitive materials while maintaining effective organic layer removal through chemical means.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method ensures clean and residue-free transfer of nanostructures to various substrates, including plastics, without the need for high-temperature processing, improving contact quality and expanding substrate compatibility.

Implementation Method 1

separating the adhesive layer together with the metal layer from the nanostructure layer and the target substrate by placing the first composite substructure in an organic solvent, wherein the organic solvent dissolves the adhesive layer

Methodology Applied

Scientific EffectDissolution: Solvation

Data Source

PatentUS9138973B1Method for transferring nanostructures

Publication Date: 2015.09.22 HON HAI PRECISION INDUSTRY CO LTD

AI summary

A method for transferring nanostructures includes providing a growth substrate and a number of nanostructures located on the growth substrate. The nanostructures are transferred by an adhesive layer from the growth substrate to a target substrate. The nanostructures are between the target substrate and the adhesive layer, and at least partial of nanostructures is in contact with a surface of the target substrate. The adhesive layer is covered by a metal layer. The adhesive layer together with the metal layer is separated from the nanostructures and the target substrate in an organic solvent by an external force, wherein the organic solvent permeates into an interface between the adhesive layer and the nanostructures.