Nanostructure Transfer via Organic Solvent Peel

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Solution Overview

Problem

Existing methods for transferring nanostructures from growth substrates to target substrates, such as silicon wafers or flexible substrates, face challenges in completely removing residues of organic sacrificial layers, leading to poor contact with metal electrodes and incompatibility with plastic substrates due to high-temperature requirements.

Innovation Solution

A method involving an adhesive layer made of organic materials like PMMA, where a metal layer is deposited on the adhesive layer to prevent dissolution and enhance mechanical strength, allowing for the use of an organic solvent to fully peel off the adhesive layer, leaving a clean nanostructure layer on the target substrate without high-temperature processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If organic sacrificial layer is used for transferring nanostructures, then transfer capability is improved, but residue removal difficulty increases

Engineering Contradiction:

Improvetransfer capabilityVSAvoidresidue removal difficulty

Core Design Contradiction:

Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The adhesive layer is segmented into two distinct surfaces with different functions: one surface provides strong adhesion to the nanostructure layer, while the other surface is designed to be easily removable by organic solvents. This segmentation allows the adhesive layer to fulfill both the transfer capability and the ease of removal requirements simultaneously.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The adhesive layer exhibits local quality differentiation where one surface has high adhesion strength to the nanostructure while the other surface has low adhesion strength for easy removal. This local quality variation resolves the contradiction by making different parts of the same component serve different purposes.

Inventive Principle:

Principle #3Local quality

2Object-generated harmful factors

If high temperature annealing is used to remove organic layer, then organic layer removal is improved, but substrate compatibility deteriorates

Engineering Contradiction:

Improveorganic layer removalVSAvoidsubstrate compatibility

Core Design Contradiction:

Object-generated harmful factorsVSAdaptability or versatility

Solution Approach 1:

The removal method is changed from thermal parameter (high temperature annealing) to chemical parameter (organic solvent dissolution). This parameter change enables effective organic layer removal without requiring high temperatures, thereby maintaining compatibility with temperature-sensitive substrates like plastics.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The thermal removal mechanism is replaced with a chemical dissolution mechanism. Instead of using heat to decompose and remove the organic adhesive layer, organic solvents are used to chemically dissolve it, providing a gentler removal approach that preserves substrate integrity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If organic sacrificial layer is used for transfer, then transfer process simplicity is improved, but electrode contact quality worsens

Engineering Contradiction:

Improvetransfer process simplicityVSAvoidelectrode contact quality

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The adhesive layer is designed with porous characteristics that allow organic solvents to penetrate and dissolve it completely. This porous structure ensures thorough removal of the adhesive layer, eliminating residues that would otherwise interfere with electrode contact quality, while maintaining the simplicity of the transfer process.

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method ensures a clean transfer of nanostructures with minimal residue, compatible with various substrates including plastics, and maintains the integrity of the nanostructures, improving contact with metal electrodes and enabling room-temperature processing.

Implementation Method 1

separating the adhesive layer together with the metal layer from the nanostructure layer and the target substrate by placing the first composite substructure in an organic solvent, wherein the organic solvent permeates into an interface between the adhesive layer and the nanostructure layer

Methodology Applied

Scientific EffectSolvation: Solvation

Implementation Method 2

a metal layer is applied on top to prevent dissolution of the adhesive layer from one surface

Methodology Applied

Scientific EffectPhysical barrier protection:

Data Source

PatentUS9168725B2Method for transferring nanostructures

Publication Date: 2015.10.27 HON HAI PRECISION INDUSTRY CO LTD

AI summary

A method for transferring nanostructures includes providing a growth substrate and a number of nanostructures located on the growth substrate. The nanostructures are transferred by an adhesive layer from the growth substrate to a target substrate. The nanostructures are between the target substrate and the adhesive layer, and at least partial of nanostructures is in contact with a surface of the target substrate. The adhesive layer is covered by a metal layer. The adhesive layer together with the metal layer is separated from the plurality of nanostructures and the target substrate in an organic solvent, wherein the organic solvent permeates into an interface between the adhesive layer and the nanostructures.