Nanostructured Substrates for Etching-Free III-V Lift-Off

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Solution Overview

Problem

Current methods for forming GaAs thin film solar cells are expensive due to costly substrates and inefficient lift-off processes, particularly the reuse of expensive substrates requiring chemical etching of sacrificial layers, and alternative approaches face complexity and cost issues.

Innovation Solution

The development of nanostructured substrates with epitaxial growth of III-V thin films on crystalline semiconductor substrates featuring nanopillars, allowing for etching-free lift-off and reuse, reducing the need for complex buffer layers and lowering substrate and lift-off costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If lattice-matched epitaxial growth is performed on germanium or GaAs single crystal substrates with sacrificial layers for lift-off, then high-efficiency III-V solar cells can be produced, but substrate cost and process complexity increase significantly

Engineering Contradiction:
Improvesolar cell efficiencyVSAvoidprocess complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the sacrificial layer concept entirely by using direct epitaxial growth on the final substrate. The III-V thin films are grown directly on the low-cost substrate without requiring a sacrificial layer that needs to be chemically etched away, thereby eliminating the complex chemical etching process while maintaining high-efficiency cell production

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces expensive, reusable substrates (germanium or GaAs single crystals) with low-cost substrates that are used once. Instead of investing in costly substrates that require careful reuse and chemical processing, the approach uses inexpensive substrates that can be discarded after a single use, dramatically reducing both substrate cost and process complexity

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Productivity

If chemical etching of sacrificial layers is used for substrate reuse, then epitaxial lift-off can be achieved, but substrate cost and environmental impact increase

Engineering Contradiction:
Improvesubstrate reuse capabilityVSAvoidchemical waste
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent extracts and eliminates the sacrificial layer from the process entirely. By growing III-V films directly on the final substrate without a sacrificial layer, the need for chemical etching is removed, eliminating harmful chemical waste while maintaining productivity through direct film transfer or substrate reuse

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent converts the potential harm of chemical etching into benefit by using direct growth methods. The chemical etching step that would generate harmful waste is replaced with a cleaner process that grows films directly on the substrate, turning what would be a harmful process into a beneficial, environmentally friendly manufacturing approach

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Ease of manufacture

If low-cost substrates with complex buffer layers are used to accommodate lattice mismatch, then substrate cost decreases, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvesubstrate costVSAvoidbuffer layer complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent removes the complex buffer layer structure by using direct epitaxial growth of III-V films on low-cost substrates. Instead of building multiple buffered layers to accommodate lattice mismatch, the approach grows the active films directly on the substrate, eliminating the buffer layer complexity while maintaining ease of manufacture through simplified processing

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies local quality by creating nanostructured surfaces or localized growth conditions on the low-cost substrate that enable direct III-V film growth. By modifying specific local regions of the substrate surface or using localized growth techniques, the patent accommodates lattice mismatch without requiring extensive buffer layers, thereby reducing device complexity while maintaining low substrate cost

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the growth of high-quality III-V thin films on low-cost substrates with reduced lattice mismatch and improved strain relief, facilitating efficient and cost-effective production of high-efficiency solar cells, potentially reducing module costs to $0.20/Wp and achieving a levelized cost of energy of $0.02-0.03/kWh by 2030.

Implementation Method 1

epitaxial growth of III-V thin films on crystalline semiconductor substrates featuring nanopillars

Methodology Applied
Scientific EffectEpitaxial growth: Epitaxy

Data Source

PatentUS10403783B2Nanostructured substrates for improved lift-off of III-V thin films
Publication Date: 2019.09.03 THE ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIV OF ARIZONA
  • US10403783B2 patent drawing
  • US10403783B2 patent drawing
  • US10403783B2 patent drawing

AI summary

Reusable nanostructured substrates for forming semiconductor thin films, such as those used in solar cells, are configured with nanopillars to permit improved lift-off of thin films.