Carbon Nanotube Capacitor Structure for Higher Withstand Voltage

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Solution Overview

Problem

Existing capacitors with conductive columnar portions of nanosized diameter face challenges in improving withstand voltage while maintaining volume capacity density, and their manufacturing is inefficient and difficult due to issues with dielectric layer uniformity and thickness on nanosized conductive columnar portions.

Innovation Solution

A capacitor design featuring first and second conductive columnar portions with nanosized diameters, supported by respective support portions and coated with dielectric layers, where the conductive portion is positioned between these columnar portions with the dielectric layers interposed, and a method involving growth, dielectric coating, and adhesive fixation to enhance withstand voltage and manufacturing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a composite capacitor is formed by stacking two identical capacitors to improve withstand voltage, then withstand voltage is improved, but volume capacity density decreases to 1/4 of the original

Engineering Contradiction:
Improvewithstand voltageVSAvoidvolume capacity density
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The capacitor is segmented into two distinct layers: a first capacitor layer with conductive columnar portions extending upward, and a second capacitor layer with conductive columnar portions extending downward. This segmentation allows each layer to contribute to capacitance independently while sharing the voltage stress, improving withstand voltage without requiring complete duplication of the entire capacitor structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a single-layer vertical structure to a multi-layer horizontal stacking structure. By arranging capacitor layers in the horizontal plane rather than stacking them vertically, the design achieves improved voltage withstanding capability while maintaining high volume capacity density through efficient space utilization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the thickness of the dielectric layer is increased to improve withstand voltage, then withstand voltage is improved, but manufacturing difficulty increases due to difficulty in stacking uniformly on nanosized conductive columnar portions

Engineering Contradiction:
Improvewithstand voltageVSAvoiddielectric layer stacking difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The dielectric layer is segmented into a first dielectric layer and a second dielectric layer, each associated with a specific capacitor layer. This segmentation allows for simplified manufacturing where each dielectric layer can be formed independently on its corresponding conductive columnar portions, avoiding the complexity of stacking a single thick dielectric layer uniformly on nanosized structures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The conductive columnar portions are formed first, followed by the formation of dielectric layers on them. This preliminary action of creating the conductive structure before adding the dielectric layer simplifies the manufacturing process, as the dielectric can be deposited conformally on the existing nanosized structures without requiring complex alignment and stacking operations.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If the thickness of the dielectric layer is increased to improve withstand voltage, then withstand voltage is improved, but manufacturing time increases

Engineering Contradiction:
Improvewithstand voltageVSAvoidmanufacturing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The capacitor structure is divided into multiple layers with thinner dielectric layers, each contributing to the overall capacitance. This segmentation allows for faster formation of each individual dielectric layer compared to forming a single thick dielectric layer, thereby reducing total manufacturing time while achieving the required withstand voltage through the combined effect of multiple layers.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The design moves from increasing thickness in the vertical dimension to increasing capacitance through horizontal layering. By stacking capacitor layers horizontally with moderate dielectric thickness, the manufacturing process avoids the time-consuming operation of forming and uniformly stacking a single thick dielectric layer on nanosized conductive structures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves improved withstand voltage while minimizing the decrease in volume capacity density and facilitates efficient and easy manufacturing of capacitors with enhanced mechanical properties using carbon nanotubes for the conductive columnar portions.

Implementation Method 1

a plurality of first conductive columnar portions 112, a first dielectric layer 114, a plurality of second conductive columnar portions 122, a second dielectric layer 124, and a conductive portion 130. Each of the plurality of first conductive columnar portions 112 has a nanosized outer diameter

Methodology Applied
Scientific EffectCarbon nanotubes: Carbon Nanotubes

Data Source

PatentUS11749463B2Capacitor and method for manufacturing the same
Publication Date: 2023.09.05 MURATA MFG CO LTD
  • US11749463B2 patent drawing
  • US11749463B2 patent drawing
  • US11749463B2 patent drawing

AI summary

A capacitor is provided having a plurality of first conductive columnar portions that each have a nanosized outer diameter. Moreover, each of a plurality of second conductive columnar portions also have a nanosized outer diameter. A conductive portion is disposed on a first dielectric layer and faces at least a part of each of the plurality of first conductive columnar portions with the first dielectric layer interposed therebetween. The conductive portion is also disposed on a second dielectric layer and faces at least a part of each of the plurality of second conductive columnar portions with the second dielectric layer interposed therebetween. A tip of each of the second conductive columnar portions is located closer to a first support portion than a tip of each of the first conductive columnar portions.