Nanotube Fitting Interconnects for LED Arrays
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Solution Overview
Problem
The challenge lies in efficiently bonding arrays of light emitting diodes (LEDs) to a backplane substrate with existing interconnect technologies, which often require precise and reliable electrical connections for large-scale display devices like virtual reality and augmented reality systems, where tens of millions of LEDs need to be connected.
Innovation Solution
The solution involves using nanotube interconnects that protrude from the LED substrate or backplane substrate, with nanostructures from one substrate fitting into the openings of nanotubes on the other to form electrical connections, allowing for the formation of an LED array with fitted nanotube interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional interconnect technologies are used to bond LED arrays to backplane substrate, then assembly process is simpler, but electrical connection reliability and bonding efficiency are insufficient for large-scale display devices
Solution Approach 1:
The interconnect structure is segmented into distinct nanotube components with protruding nanostructures on one substrate and corresponding recesses on the other substrate. This segmentation allows for modular assembly where the nanotube interconnects act as independent electrical connection elements between the LED substrate and backplane substrate, improving reliability through distributed connection points.
Solution Approach 2:
The nanostructures are designed to fit within the nanotube openings, creating a nested configuration where the protruding nanostructures from one substrate insert into the nanotube recesses of the other substrate. This nested arrangement ensures precise alignment and secure electrical contact, enhancing connection reliability while maintaining a compact interconnect structure.
2Productivity
If precise alignment is required for bonding LED arrays with existing interconnect technologies, then connection accuracy is achieved, but assembly time and manufacturing complexity increase significantly
Solution Approach 1:
The nanotube interconnect structure incorporates self-aligning features where the protruding nanostructures automatically guide themselves into the nanotube openings during the bonding process. This self-service mechanism eliminates the need for complex external alignment systems, thereby improving assembly efficiency without sacrificing alignment precision.
Solution Approach 2:
The nanotube interconnects are pre-formed with specific geometric configurations on the substrates before the bonding process. The protruding nanostructures and corresponding recesses are prepared in advance with precise dimensions and positions, enabling rapid assembly without requiring real-time alignment adjustments, thus improving productivity while maintaining manufacturing precision.
3Quantity of substance
If large numbers of LEDs are connected to backplane substrate, then display device functionality is achieved, but bonding complexity and time consumption increase
Solution Approach 1:
Multiple LED connections are merged into a unified nanotube interconnect system where arrays of nanotubes are bonded simultaneously to corresponding arrays of LED contacts. This merging approach allows tens of millions of LED connections to be established in a single bonding operation, dramatically reducing bonding time compared to individual connection methods.
Solution Approach 2:
The nanotube interconnect structure serves multiple functions simultaneously: it provides electrical connection, mechanical bonding, and alignment reference for all LED connections to the backplane substrate. This multi-functionality enables the system to handle large quantities of LED connections efficiently without requiring separate processes for each function, reducing overall bonding time and complexity.
Data Source
AI summary
A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.