Nanowire Bundle Uniformity via Segmented Glass Coating

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Solution Overview

Problem

Conventional methods for manufacturing nanowire bundles result in uneven thickness and gap deviations due to temperature differences between nanowires in peripheral and central regions, leading to quality deterioration when cut into wafers for electronic components.

Innovation Solution

A method involving parallel spinning processes to form nanowires with metal cores coated in glass, followed by a second glass layer application and controlled heating to ensure uniform bonding strength, reducing thickness and gap deviations across the nanowire bundle.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If heat treatment is performed after simply combining a plurality of nanowires, then the nanowires can be bonded together to form a bundle, but temperature differences between peripheral and central regions cause deviation in thickness and gap between nanowires

Engineering Contradiction:
Improvebonding strengthVSAvoidthickness uniformity and gap uniformity
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The invention divides the nanowire bundle structure into multiple concentric regions (central region with first plurality of nanowires, intermediate region with second plurality of nanowires, and peripheral region with third plurality of nanowires). Each region contains nanowires arranged in specific patterns with controlled spacing, allowing independent optimization of bonding and dimensional uniformity for each segment during heat treatment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention applies different structural configurations to different regions of the nanowire bundle. The central region uses a first arrangement pattern, the intermediate region uses a second pattern, and the peripheral region uses a third pattern. This local differentiation ensures that each region experiences appropriate heat distribution and bonding characteristics suited to its position, preventing the temperature-induced deviations that occur in uniform structures.

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If the physical size of nanowire bundle increases, then more nanowires can be included in the bundle, but deviation in thickness and gap between nanowires increases

Engineering Contradiction:
Improvenumber of nanowiresVSAvoidthickness uniformity and gap uniformity
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The invention segments the large-scale nanowire bundle into multiple controlled regions (central, intermediate, and peripheral zones), each containing a specific number of nanowires arranged in defined patterns. This segmentation allows the bundle to scale in size while maintaining uniformity, as each segment can be independently optimized and controlled during manufacturing and heat treatment processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention introduces radial dimensionality to the nanowire bundle structure by organizing nanowires into concentric regions extending from the center outward. This radial arrangement allows systematic control of nanowire distribution across different zones, enabling the bundle to increase in physical size while maintaining consistent thickness and gap uniformity through region-specific structural design.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method produces nanowire bundles with uniform three-dimensional structures, enhancing the quality of wafers used in electronic components by maintaining consistent thickness and gap uniformity, even as the bundle size increases.

Implementation Method 1

coating glass on metal by a spinning process to prepare a nanowire including a core and a cover

Methodology Applied
Scientific EffectSpinning process: Spin Coating

Implementation Method 2

heating and compressing the resultant coatings, and integrating a plurality of covers materials to prepare a first glass portion covering the plurality of cores

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 3

heating and compressing the resultant coatings, and integrating a plurality of covers materials to prepare a first glass portion covering the plurality of cores

Methodology Applied
Scientific EffectCompression: Compression

Data Source

PatentUS20230064255A1Nanowire bundle and method for manufacturing same
Publication Date: 2023.03.02 SAMSUNG ELECTRO MECHANICS CO LTD
  • US20230064255A1 patent drawing
  • US20230064255A1 patent drawing
  • US20230064255A1 patent drawing

AI summary

The present disclosure provides a nanowire bundle including a plurality of cores including metal and arranged in a predetermined shape at regular intervals; a first glass portion including glass and covering the plurality of cores; and a second glass portion including glass and covering the first glass portion, and a method for manufacturing the nanowire bundle.