Nanowire-Bonded Cooling Module for Leak-Safe Chip Package Heat Dissipation

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Solution Overview

Problem

Existing air cooling technologies struggle to cope with the growing heat dissipation requirements of high-performance computing and high-speed transmission semiconductor package structures, and current liquid cooling systems face challenges with sealing design, which can lead to electrical short circuits and potential fires.

Innovation Solution

A cooling module for a heterogeneous integrated semiconductor package structure that uses a cooling plate bonded to the semiconductor package and circuit board using nanowires, which also includes a fluid supply module with a vapor chamber and a metal frame for enhanced heat dissipation and sealing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If air cooling technology is used, then the cooling system is simple, but it cannot cope with high power density heat dissipation requirements

Engineering Contradiction:

Improvecooling system complexityVSAvoidheat dissipation capability

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent transitions from air cooling to liquid cooling by introducing a cooling liquid circulation system with a cooling plate, pump, and fluid channels. This hydraulic approach enables high power density heat dissipation by directly contacting the semiconductor package and circulating coolant through controlled flow paths, resolving the insufficient heat dissipation capability of air cooling.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Temperature

If liquid cooling system is implemented, then heat dissipation performance is improved, but sealing design becomes critical and complex

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidsealing design complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent employs a flexible sealing ring made of elastic material that conforms to the bonding interface between the cooling plate and semiconductor package. This thin film sealing approach provides effective leakage prevention while maintaining a relatively simple overall structure, addressing the sealing design challenges of liquid cooling systems.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The bonding structure combines multiple materials including the cooling plate, semiconductor package, sealing ring, and nanowire bonding material to create a composite assembly. This composite approach integrates thermal management, sealing, and mechanical bonding functions, reducing overall system complexity while achieving high heat dissipation performance.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If conventional bonding methods are used, then manufacturing is simple, but sealing performance is insufficient for liquid cooling

Engineering Contradiction:

Improvebonding process simplicityVSAvoidsealing performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent incorporates a pre-formed sealing ring into the bonding interface before final assembly. This preliminary sealing preparation ensures that the liquid cooling system is leak-proof from the outset, achieving reliable sealing performance while maintaining a straightforward manufacturing process that integrates the sealing function into the bonding step.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The cooling module effectively dissipates heat from high-performance semiconductor packages with high power density, while providing excellent sealing performance to prevent leakage and electrical hazards, thus ensuring reliable operation and safety.

Implementation Method 1

The nanowires may be configured to bond the cooling plate to the heterogeneous integrated semiconductor package structure, bond the cooling plate to the circuit board, or bond the cooling plate to both the heterogeneous integrated semiconductor package structure and the circuit board

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

a cooling plate and a bonding interface. The bonding interface includes a plurality of nanowires... effectively dissipates heat from high-performance semiconductor packages with high power density

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The cooling plate may be a vapor chamber that contacts the metal frame

Methodology Applied

Scientific EffectPhase change: Phase Change

Data Source

PatentUS20250140637A1Cooling module for heterogeneous integrated semiconductor package structure

Publication Date: 2025.05.01 WISTRON CORP

AI summary

A cooling module for a heterogeneous integrated semiconductor package structure is disclosed. The heterogeneous integrated semiconductor package structure is arranged on a circuit board. The cooling module includes a cooling plate and a plurality of nanowires. The nanowires may be configured to be bonded to the cooling plate, or may be configured to bond the cooling plate to the heterogeneous integrated semiconductor package structure, or may be configured to bond the cooling plate to the circuit board, or may be configured to bond the cooling plate to both the heterogeneous integrated semiconductor package structure and the circuit board.