Nanowire Distribution Promotion Layer for Narrow Bezel Contact Structures
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Solution Overview
Problem
In electronic devices, such as touch panels, the aggregation of silver nanowires at the contact surface between the copper layer and the silver nanowire layer leads to incomplete etching, resulting in poor distribution and electrical abnormalities like short circuits, which hinders the production of narrow bezel products.
Innovation Solution
A nanowire-distribution-promotion layer is introduced between the copper layer and the silver nanowire layer, formed by curing a composite organic coating material, to enhance the uniform distribution of silver nanowires, preventing aggregation and ensuring complete etching during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a copper layer and silver nanowire layer are stacked to form a contact structure, then electrical conductivity is improved, but silver nanowire aggregation occurs at the contact surface causing incomplete etching
Solution Approach 1:
An organic coating layer is introduced as an intermediary between the copper layer and silver nanowire layer. This coating layer prevents direct contact between copper and silver nanowires, eliminating the aggregation phenomenon while maintaining electrical conductivity through the stacked structure.
Solution Approach 2:
A self-assembled monolayer is formed on the copper layer surface through chemical adsorption, creating a molecular-level barrier that controls silver nanowire distribution. This monomolecular layer acts as a precision control mechanism to prevent aggregation during the stacking process.
2Manufacturing precision
If silver nanowire aggregation is prevented, then etching completeness is improved, but line width and interval reduction capability is limited
Solution Approach 1:
The organic coating layer parameters (thickness, composition, surface properties) are optimized to control silver nanowire distribution. By adjusting the coating layer characteristics, uniform nanowire spacing is achieved, enabling reduced line width and interval while maintaining complete etching.
Solution Approach 2:
The organic coating layer provides locally optimized surface properties at the contact area, creating controlled interaction zones that guide silver nanowire distribution. This local quality enhancement ensures uniform spacing specifically where needed for etching precision.
3Manufacturing precision
If a nanowire-distribution-promotion layer is added, then silver nanowire distribution uniformity is improved, but device structure complexity increases
Solution Approach 1:
The organic coating layer is applied as a thin film that self-assembles into a monomolecular structure. This self-organizing property reduces the need for complex processing equipment and multiple layers, simplifying the overall device structure while achieving uniform nanowire distribution.
Solution Approach 2:
A thin organic coating layer (nanometer scale) is used instead of thick or multiple layers. This thin film approach maintains device simplicity while providing the necessary distribution control function, minimizing the impact on device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the production of electronic devices with finer line widths and intervals, reducing the risk of electrical abnormalities and achieving the narrow bezel requirement by ensuring uniform silver nanowire distribution and complete etching.
Implementation Method 1
the nanowire-distribution-promotion layer forms a monomolecular adsorption layer on a surface of the copper layer
Data Source
AI summary
The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.