Semiconductor Package Nanowire Interface for TIM-Free Heat Dissipation
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Solution Overview
Problem
Existing semiconductor packages face inefficiencies in heat dissipation due to the degradation of thermal interface materials (TIM), leading to uneven heat distribution and accelerated degradation of components.
Innovation Solution
The integration of nanowires on both the die and lid of semiconductor packages, where the nanowires are grown in specific patterns and coupled to enhance mechanical and electrical contact, improving heat dissipation capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface material (TIM) is used between the die and the lid to assist with dissipating heat, then heat dissipation is improved, but the TIM degrades over time and recedes from edges of coverage, decreasing efficiency and concentrating heat unevenly
Solution Approach 1:
The patent removes the thermal interface material (TIM) from the heat dissipation pathway and replaces it with direct nanowire-to-nanowire contact between the die and lid. This extraction eliminates the degradation and recession problems associated with TIM while maintaining effective thermal conduction through the nanowire formations that grow directly from the die surface through the interface to the lid.
Solution Approach 2:
The patent employs nanowire formations composed of specific materials (such as copper, aluminum, or other thermally conductive materials) that grow directly from the die surface. These nanowire composite structures provide both mechanical bonding and thermal conduction functions, replacing the need for separate TIM layers while improving thermal performance and long-term reliability.
2Temperature
If TIM coverage recedes over time, then heat dissipation efficiency decreases, but heat becomes concentrated at locations still covered by TIM, accelerating degradation
Solution Approach 1:
By removing TIM entirely and using direct nanowire contact, the patent eliminates the mechanism that causes non-uniform heat distribution. The nanowire formations provide consistent thermal pathways across the entire interface area, preventing heat concentration at specific locations and the associated accelerated degradation.
Solution Approach 2:
The patent creates localized nanowire formations at specific positions on the die surface that correspond to heat-generating regions. These nanowires provide enhanced local thermal conduction pathways, ensuring uniform heat distribution across the interface while maintaining overall system reliability.
3Temperature
If nanowires are grown in specific patterns and coupled to enhance mechanical and electrical contact, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the nanowire structure into discrete formations positioned at specific locations on the die surface. Each nanowire formation acts as an independent thermal and electrical pathway, allowing for simplified manufacturing through selective growth at predefined positions rather than requiring continuous complex structures.
Solution Approach 2:
The nanowire formations serve multiple functions simultaneously: they provide mechanical bonding between die and lid, electrical connectivity for signal transmission, and thermal conduction for heat dissipation. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances thermal dissipation performance, offering improved reliability and longevity of semiconductor packages compared to traditional TIM methods, even when nanowires are misaligned.
Implementation Method 1
The integration of nanowires on both the die and lid of semiconductor packages, where the nanowires are grown in specific patterns and coupled to enhance mechanical and electrical contact, improving heat dissipation capabilities
Data Source
AI summary
Systems, apparatuses, and method for nanowires for semiconductor packages are provided herein. The semiconductor package may include die attached to a substrate. A lid may also be attached to the substrate. The die includes die nanowires and the lid includes lid nanowires. The nanowires may be formed over the entirety of the die or in a pattern. The lid may have a corresponding or symmetrical coverage or pattern. In the semiconductor package, the die nanowires and the lid nanowires are coupled to, among other things, provide improved heat dissipation.