Nanowire LED Transfer via Encapsulation and Electrostatic Grip
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Solution Overview
Problem
Conventional nanowire LED devices face challenges in efficient transfer and integration due to limitations in grip pressure and adhesion strength, especially when device sizes are reduced below certain critical dimensions, making it difficult to use vacuum chucking equipment effectively.
Innovation Solution
The development of nanowire devices with an encapsulation material that surrounds the nanowires, a stabilization layer, and an electrostatic transfer head assembly that generates high grip pressures, allowing for the transfer and integration of nanowires with smaller dimensions by adjusting the number of nanowires and using a core-shell configuration to achieve specific effective current densities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If vacuum chucking equipment is used to transfer nanowire devices, then transfer capability is provided, but grip pressure and adhesion strength are insufficient for smaller device dimensions
Solution Approach 1:
The nanowire device is segmented into multiple individual nanowires (e.g., arrays of 4, 9, 16, or more) within a single device structure. This segmentation allows the electrostatic transfer head to distribute grip pressure across multiple nanowires, achieving sufficient total adhesion force even when individual nanowire dimensions are reduced below critical thresholds.
Solution Approach 2:
The invention changes the parameter of device configuration from single nanowire to multi-nanowire arrays. By adjusting the number of nanowires in the array, the effective current density and total grip pressure can be optimized to overcome the insufficient adhesion force problem for smaller device dimensions.
2Device complexity
If single nanowire devices are used, then device simplicity is maintained, but effective current density control is limited
Solution Approach 1:
By changing from single nanowire to multi-nanowire arrays with varying numbers of nanowires (4, 9, 16, etc.), the effective current density can be precisely controlled. This parameter change allows optimization of device performance for specific applications while maintaining a relatively simple core-shell nanowire structure.
Solution Approach 2:
The multi-nanowire array structure serves multiple functions: it provides sufficient grip pressure for transfer, enables effective current density control, and maintains structural simplicity through the repeating core-shell nanowire configuration. This universal structure can be adapted to various applications by adjusting the array size.
3Area of moving object
If core-shell nanowire configuration is used, then active region surface area is increased, but device manufacturing complexity increases
Solution Approach 1:
The core-shell configuration implements a nested structure where the core nanowire is surrounded by a shell layer, creating a compact multi-layer structure. This nesting approach increases the active region surface area within a small footprint while maintaining structural organization and facilitating manufacturing through sequential deposition processes.
Solution Approach 2:
The core-shell nanowire structure uses composite materials with different properties in the core and shell regions. This composite approach enables independent optimization of each layer's function while maintaining overall structural integrity, balancing the increased surface area benefit against manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the successful transfer and integration of nanowire devices with improved grip pressures and adhesion strength, overcoming previous limitations in device size and efficiency, particularly at low operating currents and effective current densities.
Implementation Method 1
an electrostatic transfer head assembly that generates high grip pressures
Data Source
AI summary
A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a plurality of nanowires on and protruding away from a first surface of the base layer. An encapsulation material laterally surrounds the plurality of nanowires in the nanowire device, such that the nanowires are embedded within the encapsulation material.