Nanowire-Plated Nanoparticle Bonding for Room-Temperature Joining

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Solution Overview

Problem

Conventional methods for attaching multiple components together, such as in semiconductor packages, face issues with adhesion strength, mechanical stability, electrical and thermal conductivity, and electromigration, often requiring complex and costly processes.

Innovation Solution

A system comprising nanoparticles and nanowires, where the nanoparticles are deposited on surfaces and nanowires are plated onto them, allowing the nanowires to fuse at room temperature under pressure, providing strong adhesion and stability with improved electrical and thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional adhesive materials are used to attach components, then ease of manufacture is improved, but adhesion strength and mechanical stability deteriorate

Engineering Contradiction:

Improveease of manufactureVSAvoidadhesion strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The invention changes the physical and chemical parameters of the attachment system by using nanoscale materials (nanoparticles and nanowires) instead of conventional macroscopic adhesives. The nanowires provide enhanced mechanical interlocking and bonding strength while maintaining ease of application through deposition processes.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention employs a composite attachment system consisting of nanoparticles and nanowires that combine the benefits of nanoscale materials with traditional adhesive application methods. This composite structure provides both strong adhesion and mechanical stability while remaining easy to manufacture.

Inventive Principle:

Principle #40Composite materials

2Device complexity

If conventional attachment methods are used, then device complexity is reduced, but electrical and thermal conductivity deteriorate

Engineering Contradiction:

Improvedevice complexityVSAvoidelectrical and thermal conductivity

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The invention changes the material parameters at the nanoscale to achieve superior electrical and thermal conductivity. The nanowire structure provides continuous conductive pathways that enhance reliability without significantly increasing device complexity, as the nanowires can be integrated into existing manufacturing processes.

Inventive Principle:

Principle #35Parameter changes

3Ease of operation

If conventional adhesives are used, then ease of operation is improved, but mechanical stability and resistance to electromigration worsen

Engineering Contradiction:

Improveease of operationVSAvoidmechanical stability

Core Design Contradiction:

Ease of operationVSStability of the object's composition

Solution Approach 1:

The invention changes the operational parameters by using nanowire-based attachment that maintains ease of operation through simple deposition processes while providing superior mechanical stability. The nanoscale dimensions and high surface-area-to-volume ratio of nanowires enable strong bonding without complex application procedures.

Inventive Principle:

Principle #35Parameter changes

4Ease of manufacture

If conventional attachment materials are used, then manufacturing cost is reduced, but adhesion strength and reliability deteriorate

Engineering Contradiction:

Improvemanufacturing costVSAvoidadhesion strength

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The invention changes the material parameters to nanoscale dimensions, enabling strong adhesion and high reliability while maintaining cost-effectiveness through established deposition and plating technologies. The nanowire structure provides enhanced bonding strength without requiring expensive new manufacturing equipment or processes.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The nanowire-plated-nanoparticle system offers strong adhesion, mechanical stability, reduced electromigration, and efficient heat dissipation, simplifying the attachment process while enhancing electrical and thermal conductivity.

Implementation Method 1

depositing a set of nanoparticles on a surface

Methodology Applied

Scientific EffectDeposition: Deposition (physical)

Implementation Method 2

electroplating the set of nanoparticles to cause a set of nanowires to extend from the set of nanoparticles and through the plurality of orifices

Methodology Applied

Scientific EffectElectroplating: Electroplating

Implementation Method 3

The first and second sets of nanowires are fused to each other

Methodology Applied

Scientific EffectFusion: Nuclear Fusion

Data Source

PatentUS11869864B2Nanowires plated on nanoparticles

Publication Date: 2024.01.09 TEXAS INSTRUMENTS INC

AI summary

In some examples, a system comprises a set of nanoparticles and a set of nanowires extending from the set of nanoparticles.