Nanowire Gate Structure With Negative Capacitance for Parasitic Reduction

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Solution Overview

Problem

As semiconductor devices miniaturize, the increasing proximity of components leads to higher overlapping capacitances, particularly between the bottom substrate and gate, which is undesirable and needs to be reduced.

Innovation Solution

A nanowire/nanosheet device with a ferroelectric or negative capacitance material layer on the sidewall of the gate electrode is introduced, allowing for the adjustment of device characteristics such as threshold voltage and capacitance, achieved through the use of a ferroelectric or negative capacitance material in the form of a spacer or within a gate trench.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If device miniaturization is pursued to achieve further scaling, then device size is reduced and integration density is improved, but overlapping capacitances between components increase

Engineering Contradiction:
Improvedevice sizeVSAvoidoverlapping capacitance
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

A ferroelectric or negative capacitance material layer is introduced as an intermediary between the gate electrode and source/drain regions. This intermediate layer provides negative capacitance that compensates for the harmful overlapping capacitance, allowing miniaturization to proceed without proportionally increasing parasitic effects

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The capacitance characteristic of the gate structure is changed by incorporating ferroelectric or negative capacitance material. This material exhibits negative capacitance behavior that actively reduces the total overlapping capacitance, transforming the electrical parameter of the gate-source/drain interface

Inventive Principle:
Principle #35Parameter changes

2Quantity of substance

If spacing between components is reduced to increase integration density, then device capacity is improved, but capacitance between bottom substrate and gate increases

Engineering Contradiction:
Improveintegration densityVSAvoidsubstrate-gate capacitance
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The ferroelectric or negative capacitance material layer serves as an intermediary that decouples the capacitive coupling between the gate and source/drain regions. This allows components to be placed closer together while the intermediate layer prevents excessive capacitance accumulation

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The negative capacitance material is positioned in advance between the gate and source/drain to preemptively counteract the harmful capacitive coupling that would otherwise occur due to close spacing. This preliminary anti-action prevents the harmful effect before it can degrade device performance

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the total capacitance by introducing negative capacitance between the gate and source/drain, potentially lowering the Subthreshold Swing to less than 60 mV/dec at 300K, thereby improving device performance and reducing overlapping capacitances.

Implementation Method 1

a ferroelectric or negative capacitance material layer formed on a sidewall of the gate electrode

Methodology Applied
Scientific EffectFerroelectric effect:

Implementation Method 2

The ferroelectric or negative capacitance material layer may be in a form of a spacer. Device characteristics, such as a threshold voltage (Vt), a Drain Induced Barrier Lowering (DIBL), a Subthreshold Swing (SS), etc., may be easily adjusted by adjusting a material of the ferroelectric or negative capacitance material layer.

Methodology Applied
Scientific EffectNegative capacitance:

Data Source

PatentUS20240030313A1Device having ferroelectric or negative capacitance material and method of manufacturing the same, and electronic apparatus
Publication Date: 2024.01.25 INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
  • US20240030313A1 patent drawing
  • US20240030313A1 patent drawing
  • US20240030313A1 patent drawing

AI summary

A nanowire/nanosheet device having a ferroelectric or negative capacitance material and a method of manufacturing the same, and an electronic apparatus including the nanowire/nanosheet device are provided. According to embodiments, the semiconductor device may include: a substrate; a nanowire/nanosheet on the substrate and spaced apart from a surface of the substrate; a gate electrode surrounding the nanowire/nanosheet; a ferroelectric or negative capacitance material layer formed on a sidewall of the gate electrode; and source/drain layers at opposite ends of the nanowire/nanosheet and adjoining the nanowire/nanosheet.